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公开(公告)号:US11789093B1
公开(公告)日:2023-10-17
申请号:US17523910
申请日:2021-11-11
Applicant: SeeScan, Inc.
Inventor: Mark S. Olsson , Allen P. Hoover , Sequoyah Aldridge , Stephanie M. Bench
CPC classification number: G01R33/0206 , G01C9/00 , G01P15/18 , G01R33/0082 , G01V3/081
Abstract: Sensor modules for measuring parameters such as magnetic fields, tilts, orientation, or other parameters in high resolution in three orthogonal axes using single-axis sensor arrays are disclosed.
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公开(公告)号:US10777919B1
公开(公告)日:2020-09-15
申请号:US16144878
申请日:2018-09-27
Applicant: SeeScan, Inc.
Inventor: Mark S. Olsson , Allen P. Hoover , Jan Soukup , James F. Kleyn
Abstract: Electrical contact clips for use in utility locating operations to couple signals from a transmitter to a hidden or buried utility via direct electrical contact are disclosed. In one embodiment, a clip includes a base assembly and a jaw assembly having a plurality of jaws coupled to the base assembly, wherein each jaw is independently movably openable and closeable to secure to a target utility, a handle element on the base assembly having a utility selector element for selecting a utility type, and a contact element on the jaw assembly to directly conductively couple electrical signals onto a utility.
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公开(公告)号:US12107353B1
公开(公告)日:2024-10-01
申请号:US18368510
申请日:2023-11-27
Applicant: SeeScan, Inc.
Inventor: Mark S. Olsson , Allen P. Hoover , James F. Kleyn , Jan Soukup
CPC classification number: H01R11/24 , H01R4/26 , H01R4/4863
Abstract: Electrical contact clips for use in utility locating operations to couple signals from a transmitter to a hidden or buried utility via direct electrical contact are disclosed.
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公开(公告)号:US11769956B1
公开(公告)日:2023-09-26
申请号:US17013831
申请日:2020-09-07
Applicant: SeeScan, Inc.
Inventor: Mark S. Olsson , Allen P. Hoover , James F. Kleyn , Jan Soukup
CPC classification number: H01R11/24 , H01R4/26 , H01R4/4863
Abstract: Electrical contact clips for use in utility locating operations to couple signals from a transmitter to a hidden or buried utility via direct electrical contact are disclosed.
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公开(公告)号:US11187761B1
公开(公告)日:2021-11-30
申请号:US16178494
申请日:2018-11-01
Applicant: SeeScan, Inc.
Inventor: Mark S. Olsson , Allen P. Hoover , Sequoyah Aldridge , Stephanie M. Bench
Abstract: Sensor modules for measuring parameters such as magnetic fields, tilts, orientation, or other parameters in high resolution in three orthogonal axes using single-axis sensor arrays are disclosed.
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