公开(公告)号：US20020179122A1

公开(公告)日：2002-12-05

申请号：US10164164

申请日：2002-06-05

Applicant: Semitool, Inc.

Inventor： Raymon F. Thompson ,  Clif Neil

IPC: B08B003/02

CPC classification number: H01L21/67313 ,  B08B3/02 ,  Y10S134/901 ,  Y10S134/902 ,  Y10S414/14

Abstract: In a method for processing flat media, such as semiconductor wafers, first and second cassettes carrying wafers are loaded into a dual position rotor. The cassettes are restrained within the rotor by support tubes and hold down pins. Processing capacity is increased, as two cassettes are simultaneously processed.

Abstract translation: 在用于处理诸如半导体晶片的扁平介质的方法中，将携带晶片的第一和第二盒装载到双位置转子中。 通过支撑管和压紧销将盒子限制在转子内。 随着两个盒被同时处理，处理能力增加。