Workpiece processing system
    1.
    发明申请
    Workpiece processing system 审中-公开
    工件加工系统

    公开(公告)号:US20040040583A1

    公开(公告)日:2004-03-04

    申请号:US10654849

    申请日:2003-09-04

    Applicant: Semitool, Inc.

    Abstract: A workpiece processing system for processing semiconductor wafers and other flat media includes a standalone processing unit having two or more modules vertically stacked on top of one another. A first module includes an ozone generator, a DI water supply, a purge gas/drying gas supply, and optionally includes an ammonium hydroxide generator. A second module is preferably stacked on top of the first module and includes a processing chamber in communication with the devices in the first module. The processing chamber preferably includes a rotor for holding and rotating workpieces, one or more spray manifolds, an ozone destructor, an anti-static generator, and/or any other suitable workpiece-processing devices. The rotor is preferably designed to hold two workpiece-carrying cassettes each capable of holding up to 25 workpieces. A third module is preferably stacked on top of the second module and includes the system electronics and controls.

    Abstract translation: 用于处理半导体晶片和其它平面介质的工件处理系统包括具有彼此垂直堆叠的两个或更多个模块的独立处理单元。 第一模块包括臭氧发生器,去离子水供应源,净化气体/干燥气体源,并且任选地包括氢氧化铵发生器。 第二模块优选堆叠在第一模块的顶部上,并且包括与第一模块中的装置通信的处理室。 处理室优选地包括用于保持和旋转工件的转子,一个或多个喷雾歧管,臭氧破坏器,防静电发生器和/或任何其它合适的工件加工装置。 转子优选地设计成容纳两个能够容纳多达25个工件的工件运载盒。 第三模块优选地堆叠在第二模块的顶部并且包括系统电子装置和控制。

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