公开(公告)号：US11898920B2

公开(公告)日：2024-02-13

申请号：US17741257

申请日：2022-05-10

Applicant: Sensata Technologies, Inc.

Inventor： Engbertus Berkel ,  Thomas Gerjen Hendrik Kouwen ,  Jonathan M. Rigelsford

IPC: G01L19/00 ,  H05K9/00 ,  G01L19/14

CPC classification number: G01L19/0038 ,  G01L19/0061 ,  G01L19/147 ,  H05K9/0073

Abstract: A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.

公开(公告)号：US20230366764A1

公开(公告)日：2023-11-16

申请号：US17741257

申请日：2022-05-10

Applicant: Sensata Technologies, Inc.

Inventor： Engbertus Berkel ,  Thomas Gerjen Hendrik Kouwen ,  Jonathan M. Rigelsford

IPC: G01L19/00 ,  G01L19/14 ,  H05K9/00

CPC classification number: G01L19/0038 ,  G01L19/147 ,  H05K9/0073 ,  G01L19/0061

Abstract: A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.