公开(公告)号：US10288513B2

公开(公告)日：2019-05-14

申请号：US15265225

申请日：2016-09-14

Applicant: Sensata Technologies, Inc.

Inventor： Jun H. Bae ,  Nikhil B. Lal ,  Guanshi Li ,  Shuo Robert Chen ,  Mark W. McBrine

IPC: G01K13/00 ,  G01L19/00 ,  G01K7/22 ,  G01K1/08 ,  G01D21/02

Abstract: A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process.

公开(公告)号：US20180073950A1

公开(公告)日：2018-03-15

申请号：US15265225

申请日：2016-09-14

Applicant: Sensata Technologies, Inc.

Inventor： Jun H. Bae ,  Nikhil B. Lal ,  Guanshi Li ,  Shuo Robert Chen ,  Mark W. McBrine

IPC: G01L19/00 ,  G01K7/22

CPC classification number: G01L19/0092 ,  G01D21/02 ,  G01K1/08 ,  G01K7/22 ,  G01L19/0038 ,  G01L19/0084

Abstract: A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process.