公开(公告)号：US06704248B1

公开(公告)日：2004-03-09

申请号：US09864452

申请日：2001-05-25

Applicant: Shabriar Shey Sabripour

Inventor： Shabriar Shey Sabripour

IPC: H05K118

CPC classification number: H01F17/0013 ,  H01F41/046 ,  H01L23/5383 ,  H01L23/5386 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09672 ,  H01L2924/00

Abstract: The present invention is directed towards a multilayered circuit module and a method for constructing such a module, wherein the module has passive components such as capacitors, inductors, transformers distributed into a ceramic substrate. This module provides an optimally close packing density of these components without wasting large areas of unused substrate. The module of the present invention weaves capacitors, inductors, and transformers into the substrate without the use of printed circuit boards and eliminating discrete components. The substrate of the module becomes a functional component itself, rather than just a block receptacle for discrete components. The module of the present invention provides a very densely packed power supply with good heat conduction properties and which is also less costly to build than HDI modules.

Abstract translation: 本发明涉及一种用于构造这种模块的多层电路模块和方法，其中该模块具有诸如电容器，电感器，分布在陶瓷衬底中的变压器等无源元件。 该模块提供了这些组件的最佳封闭密度，而不浪费大面积未使用的基板。 本发明的模块将电容器，电感器和变压器编织到衬底中而不使用印刷电路板并消除分立元件。 模块的基板本身就成为功能部件，而不仅仅是用于分立部件的块式插座。 本发明的模块提供了具有良好导热性能的非常密集的电源，并且与HDI模块相比，构建成本也更低。