公开(公告)号：US20200062889A1

公开(公告)日：2020-02-27

申请号：US16466092

申请日：2017-02-21

Applicant: Shengyi Technology Co., Ltd.

Inventor： Cheng LUO ,  Guofang TANG ,  Jiangling ZHANG

IPC: C08G59/40 ,  C08L63/00

Abstract: Provided in the present invention is a thermosetting resin composition, comprising phosphorus-containing active ester and epoxy resin, the phosphorus-containing active ester being copolymerised using bis-aromatic formyl chloride hydrocarbyl phosphine oxide and one of bis-hydroxyl aromatic hydrocarbyl phosphine oxide, bis-hydroxyl aromatic oxyhydrocarbyl phosphine oxide, or hydroxylated DOPO, and then obtained from aromatic formyl chloride end capping; the thermosetting resin composition provided in the present invention has the advantages of good thermal stability, humidity resistance and heat resistance, a low dielectric constant and dielectric loss tangent, a low rate of water absorption, and halogen-free flame-retardant properties, and has excellent machinability; also provided in the present invention are applications of the thermosetting resin composition for resin sheet material, resin composite metal foil, prepreg, laminated plate, metal foil-clad laminated plate, and printed circuit boards.

公开(公告)号：US20240110027A1

公开(公告)日：2024-04-04

申请号：US18270290

申请日：2021-03-19

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cheng LUO ,  Yundong MENG ,  Shanyin YAN

IPC: C08J5/24 ,  C08K5/00 ,  C08L33/04 ,  C08L47/00 ,  C08L53/02 ,  C08L71/12 ,  H05K1/03

CPC classification number: C08J5/244 ,  C08J5/249 ,  C08K5/0066 ,  C08L33/04 ,  C08L47/00 ,  C08L53/02 ,  C08L71/126 ,  H05K1/0366 ,  C08J2309/06 ,  C08J2315/00 ,  C08J2333/04 ,  C08J2353/02 ,  C08J2371/12 ,  C08K2201/005 ,  C08K2201/011 ,  C08L2203/30 ,  C08L2205/035 ,  C08L2312/02

Abstract: The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%-85%, the added amount of said component B is 10%-95%, and the added amount of said component C is 1%-70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.

公开(公告)号：US20240228765A1

公开(公告)日：2024-07-11

申请号：US18541487

申请日：2023-12-15

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cheng LUO ,  Shanyin YAN ,  Jiangling ZHANG

IPC: C08L53/02 ,  C08J5/24 ,  C08L9/00 ,  C08L25/16 ,  C09D109/00 ,  C09D125/16 ,  C09D153/02 ,  H05K1/03

CPC classification number: C08L53/02 ,  C08J5/249 ,  C08L9/00 ,  C08L25/16 ,  C09D109/00 ,  C09D125/16 ,  C09D153/02 ,  H05K1/032 ,  C08J2309/00 ,  C08J2325/16 ,  C08J2353/02 ,  C08J2409/00 ,  C08J2425/16 ,  C08J2453/02

Abstract: Resin composition, insulating resin film and use thereof. The resin composition comprises the following components in parts by mass: 50-90 parts of a hydrogenated hydrocarbon resin and 10-50 parts of a benzocyclobutene resin; the benzocyclobutene resin comprises at least one structural unit A and at least one structural unit B. The hydrogenated hydrocarbon resin and the benzocyclobutene resin with a specific structure are both total-hydrocarbon structures, having low dielectric constant Dk, dielectric loss tangent Df, and water absorption rate. The benzocyclobutene resin can be thermally cured to obtain the high cross-linking density, high glass transition temperature, and excellent heat resistance. The resin composition and the insulating resin film prepared therewith have ultra-low dielectric constant and loss tangent, excellent dielectric properties, heat resistance, damp heat resistance, adhesion strength, and excellent mechanical properties such as flexibility, satisfying the performance requirements of electronic components being high frequency, high speed, and high integration.

公开(公告)号：US20180050515A1

公开(公告)日：2018-02-22

申请号：US15563185

申请日：2015-09-21

Applicant: Shengyi Technology Co., Ltd.

Inventor： Cheng LUO ,  Guofang TANG

IPC: B32B15/08 ,  B32B15/092 ,  B32B27/38 ,  C08G65/48 ,  C08L63/00 ,  C08G59/42 ,  C08J5/24 ,  C08J5/04 ,  H05K1/03

CPC classification number: B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  B32B27/28 ,  B32B27/38 ,  B32B2307/3065 ,  B32B2457/00 ,  C08G59/4269 ,  C08G65/48 ,  C08G65/485 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2463/00 ,  C08J2471/12 ,  C08L47/00 ,  C08L61/14 ,  C08L63/00 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  C08L79/08 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/012

Abstract: The present invention provides an active ester, a thermosetting resin composition, a prepreg and a laminated board containing same. The active ester is a PPO main chain-containing double-ended polyfunctional active ester, and the thermosetting resin composition comprises epoxy resin and the PPO main chain-containing double-ended polyfunctional active ester. The prepreg, laminated board and copper-clad plate prepared from the thermosetting resin composition containing the PPO main chain-containing double-ended polyfunctional active ester have excellent dielectric properties, damp-heat resistance, heat resistance, extremely low water absorption and high bending strength.