公开(公告)号：US20210307164A1

公开(公告)日：2021-09-30

申请号：US17162122

申请日：2021-01-29

Applicant: Shengyi Technology Co., Ltd.

Inventor： Weifeng YIN ,  Cui HUO ,  Rui LIU ,  Yongjing XU ,  Shanyin YAN

IPC: H05K1/03 ,  C09J153/02 ,  C09J179/08 ,  C09J171/12 ,  C09J11/06

Abstract: The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.