公开(公告)号：US20180346675A1

公开(公告)日：2018-12-06

申请号：US15780621

申请日：2016-09-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Wenxin Chen ,  Cuiming Du ,  Songgang Chai

IPC: C08J9/10 ,  C08J5/24 ,  C08L79/08 ,  C08L71/00 ,  C08L67/00 ,  C08L63/00 ,  C08L83/04 ,  C08K5/00

CPC classification number: B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  C08J5/24 ,  C08J9/10 ,  C08J9/28 ,  C08L61/06 ,  C08L63/00 ,  H05K1/03

Abstract: A thermosetting resin composition. The composition comprises thermosetting resin, a cross-linking agent, accelerator, and a porogen. The porogen is a porogen capable of being dissolved in an organic solvent. The organic solvent is an organic solvent capable of dissolving the thermosetting resin. A mode of directly adding the dissolvable porogen to a resin system is used, tiny pores that are uniform in pore diameter can be evenly distributed in resin matrix by means of a simple process at low cost, and the high-performance composition having a low dielectric constant and low dielectric loss is obtained; the method has good applicability to a great number of resin systems; because the pore size in the system reaches a nanometer grade, performance of the final system, such as mechanical strength, thermal performance and water absorption rate, is not sacrificed.