LED packaging material and manufacturing method of the same

    公开(公告)号:US10418531B2

    公开(公告)日:2019-09-17

    申请号:US15737159

    申请日:2017-06-09

    Inventor: Haijun Wang

    Abstract: The present invention provides a light-emitting diode (LED) packaging material, which is formed by compounding the graphene with the silane or the epoxy resin, to improve the defects of manufacturing the LED packaging material of the single silane or the epoxy resin, with the help of the properties of graphene, so as to improve the performance of the LED packaging material. The present invention further provides a manufacturing method of a LED packaging material. The LED packaging material and the manufacturing method of the present invention, which is formed by compounding the graphene with the silane or the epoxy resin, to improve the defects of manufacturing the LED packaging material of the single silane or the epoxy resin, with the help of the properties of graphene, so as to improve the performance of the LED packaging material.

    Display panel and manufacturing method based on BOA technology

    公开(公告)号:US10365523B2

    公开(公告)日:2019-07-30

    申请号:US15117197

    申请日:2016-05-17

    Abstract: A manufacturing method for a display panel based on BOA technology is disclosed. The method includes an array substrate, wherein, the array substrate includes a display region and a non-display region; forming a color photoresist layer and a black matrix layer on the array substrate, and in a process of forming the color photoresist layer and/or the black matrix layer, forming a spacer simultaneously. A display panel based on BOA technology is also disclose. In the processes of forming the color photoresist layer and/or the black matrix layer, forming the spacer simultaneously to reduce a process for individually forming the spacer such that the manufacturing processes of the display panel are reduced to decrease the production cost.

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