公开(公告)号：US10350692B2

公开(公告)日：2019-07-16

申请号：US14597635

申请日：2015-01-15

Applicant: Shinkawa Ltd.

Inventor： Kohei Seyama ,  Yasuhiro Chida ,  Osamu Kakutani

IPC: B23K3/08 ,  H01L23/00 ,  B23K3/047 ,  H05B3/14 ,  H05B3/26 ,  B23K1/00 ,  B23K101/42

Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.