公开(公告)号：US20150028913A1

公开(公告)日：2015-01-29

申请号：US14074187

申请日：2013-11-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Kuang-Ching Fan ,  Hsin-Hung Lee

IPC: G01R31/26

CPC classification number: G01R31/2853 ,  G01R31/2865

Abstract: The present invention proposes a testing method for testing a semiconductor element, including: providing a semiconductor element having a first surface on which a first testing area is formed and a second surface on which a second testing surface is formed; placing the semiconductor element on a plane surface, allowing any one of the first surface and the second surface to be in no parallel to the plane surface; and electrically connecting a testing apparatus to the first testing area and the second testing area of the semiconductor element. The semiconductor element is placed in a non-horizontal manner on the testing apparatus, which makes contact with the two opposing surfaces of the semiconductor element in a horizontal way without directly exerting a downward force against the surface of the semiconductor element, thereby preventing the semiconductor element from damages.

Abstract translation: 本发明提出一种半导体元件的测试方法，包括：提供具有形成有第一测试区域的第一表面的半导体元件和形成有第二测试表面的第二表面; 将所述半导体元件放置在平面上，使得所述第一表面和所述第二表面中的任何一个不平行于所述平面; 并将测试装置电连接到半导体元件的第一测试区域和第二测试区域。 半导体元件以非水平的方式放置在测试装置上，其以水平方式与半导体元件的两个相对的表面接触而不会直接向半导体元件的表面施加向下的力，从而防止半导体元件 元素不受损害。