公开(公告)号：US11102890B2

公开(公告)日：2021-08-24

申请号：US16201239

申请日：2018-11-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ying-Chang Tseng ,  Yuan-Hung Hsu ,  Chang-Fu Lin

IPC: H01Q1/22 ,  H01Q1/38 ,  H05K3/34 ,  H05K1/18 ,  H01Q1/24 ,  H05K3/36

Abstract: This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.

公开(公告)号：US20200093006A1

公开(公告)日：2020-03-19

申请号：US16201239

申请日：2018-11-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ying-Chang Tseng ,  Yuan-Hung Hsu ,  Chang-Fu Lin

IPC: H05K3/34 ,  H05K1/18 ,  H01Q1/22 ,  H01Q1/38

Abstract: This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.