公开(公告)号：US20240196514A1

公开(公告)日：2024-06-13

申请号：US18438554

申请日：2024-02-12

Applicant: Sofwave Medical Ltd.

Inventor： Ariel SVERDLIK ,  Erez PANIR

IPC: H05K1/02 ,  B06B1/00

CPC classification number: H05K1/0204 ,  B06B1/00 ,  H05K1/0209 ,  H05K1/021 ,  B06B2201/40

Abstract: An assembly including:



a printed circuit board (PCB) having a first surface and a second surface;
at least one energy transmitter mounted on the first surface;
at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.

公开(公告)号：US20230345615A1

公开(公告)日：2023-10-26

申请号：US18215971

申请日：2023-06-29

Applicant: Sofwave Medical Ltd.

Inventor： Ariel SVERDLIK ,  Erez PANIR

IPC: H05K1/02 ,  B06B1/00

CPC classification number: H05K1/0204 ,  B06B1/00 ,  H05K1/0209 ,  H05K1/021 ,  B06B2201/40

Abstract: An assembly including:

a printed circuit board (PCB) having a first surface and a second surface;
at least one energy transmitter mounted on the first surface;
at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.