公开(公告)号：US20230171915A1

公开(公告)日：2023-06-01

申请号：US17910485

申请日：2020-09-24

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya TSUCHIDA ,  Keiichi AOKI ,  Yasuhiro OOTORI ,  Yuta TAMAKI ,  Mitsuharu MORISHITA

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/2039 ,  H05K7/20336

Abstract: Not only cooling performance for an integrated circuit such as a CPU but also cooling performance for a power supply unit is improved. An electronic apparatus (1) includes a first heat sink (71) and a power supply unit (60) including a power supply unit case (61) having an intake air wall (61a) in which a plurality of air intake holes (61b) are formed. The intake air wall (61b) is located in front of the first heat sink (71). The intake air wall (61b) has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink (71). A cooling fan (5) is disposed to feed air toward the intake air wall (61a).