公开(公告)号：US10993055B2

公开(公告)日：2021-04-27

申请号：US16664079

申请日：2019-10-25

Applicant: Starkey Laboratories, Inc.

Inventor： Sidney A. Higgins ,  John Becker

IPC: H04R1/10 ,  H04R25/00

Abstract: Described is a solid wax mitigation barrier for a hearing aid that is cleanable via a simple wiping motion, is not a cause of irritation within the ear canal, and is acoustically transparent. In one embodiment, a wax barrier function is provided by a tube cap for fitting over the acoustic port tube of a hearing aid receiver. The tube cap may be constructed of an elastomeric high tear strength material so as create a small flexible acoustic tube cap that prevents direct ingress of wax into the hearing aid receiver. The design of the cap may also include a bridge that spans an acoustic port inlet so as to block direct material ingress.

公开(公告)号：US10462589B2

公开(公告)日：2019-10-29

申请号：US15274696

申请日：2016-09-23

Applicant: Starkey Laboratories, Inc.

Inventor： Sidney A. Higgins ,  John Becker

IPC: H04R1/10 ,  H04R25/00

Abstract: Described is a solid wax mitigation barrier for a hearing aid that is cleanable via a simple wiping motion, is not a cause of irritation within the ear canal, and is acoustically transparent. In one embodiment, a wax barrier function is provided by a tube cap for fitting over the acoustic port tube of a hearing aid receiver. The tube cap may be constructed of an elastomeric high tear strength material so as create a small flexible acoustic tube cap that prevents direct ingress of wax into the hearing aid receiver. The design of the cap may also include a bridge that spans an acoustic port inlet so as to block direct material ingress.

公开(公告)号：US09949051B2

公开(公告)日：2018-04-17

申请号：US15172933

申请日：2016-06-03

Applicant: Starkey Laboratories, Inc.

Inventor： Sidney A. Higgins ,  John Becker ,  Thomas Bartosh ,  Joel Erdman

IPC: H04R25/00 ,  H04R31/00 ,  H04R19/04 ,  H04R1/04

CPC classification number: H04R31/006 ,  H04R1/04 ,  H04R19/04 ,  H04R25/604 ,  H04R31/003 ,  H04R2201/003 ,  H04R2201/029

Abstract: Described are techniques for creating acoustic inlet manifolds for a microphone that utilize existing flex or printed circuit board (PCB) technology to create an ultra-low profile manifold. The described techniques: take advantage of the ability to allow reflow connection. By embedding an acoustic path between the layers or creating an acoustic path on the surface of a flex or PCB assembly, the microphone can be reflowed onto the manifold assembly.