公开(公告)号：US20050042782A1

公开(公告)日：2005-02-24

申请号：US10919676

申请日：2004-08-16

Applicant: Steven Hamren ,  Daniel Cram

Inventor： Steven Hamren ,  Daniel Cram

IPC: G01R1/04 ,  H05K3/32 ,  G01R31/26

CPC classification number: G01R1/0408 ,  G01R1/0433 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/321 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.

公开(公告)号：US20060284631A1

公开(公告)日：2006-12-21

申请号：US11140720

申请日：2005-05-31

Applicant: Steven Hamren

Inventor： Steven Hamren

IPC: G01R31/02

CPC classification number: G01R31/2641 ,  G01J1/04 ,  G01J1/0474 ,  G01J1/08 ,  G01R1/0433 ,  G01R31/27

Abstract: A test socket, a test system and methods of testing an image sensor or other optically interactive device. The test system may include a light source for illuminating the image sensor device. A diffuser may be provided to scatter the light. A test socket may include an area configured for receiving the image sensor device. The image sensor device may be in electrical communication with a printed circuit board. The diffuser may be positioned within the test socket or affixed to the printed circuit board. Optionally, the diffuser may provide support for the image sensor device, or a seat of at least partially optically clear material may provide support for the image sensor device. In another embodiment, a test socket includes a seat of at least partially optically clear material enabling collimated light or diffused light to reach the image sensor device.

Abstract translation: 测试插座，测试系统和测试图像传感器或其他光学交互设备的方法。 测试系统可以包括用于照亮图像传感器设备的光源。 可以提供扩散器来散射光。 测试插座可以包括被配置用于接收图像传感器装置的区域。 图像传感器装置可以与印刷电路板电连通。 扩散器可以位于测试插座内或固定到印刷电路板上。 可选地，漫射器可以为图像传感器装置提供支撑，或者至少部分光学透明材料的座可以为图像传感器装置提供支撑。 在另一个实施例中，测试插座包括至少部分光学透明材料的座，使得能够准直的光或扩散的光到达图像传感器装置。

公开(公告)号：US20050017739A1

公开(公告)日：2005-01-27

申请号：US10919667

申请日：2004-08-16

Applicant: Steven Hamren ,  Daniel Cram

Inventor： Steven Hamren ,  Daniel Cram

IPC: G01R1/04 ,  H05K3/32 ,  G01R31/302 ,  G01R31/02

CPC classification number: G01R1/0408 ,  G01R1/0433 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/321 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.

Abstract translation: 为半导体器件的处理和测试提供了改进的方法和设备。 一个实施例包括用于一个或多个具有非常细间距的电I / O（输入/输出）元件的半导体管芯的管芯载体。 半导体裸片以单一形式临时附接到模具载体，以便能够用常规接触技术测试骰子。 模具载体可以包括柔性电路基底基板和刚性支撑框架。 另外的实施例包括用于将半导体管芯附接到管芯载体并用于在测试期间提供与半导体管芯的临时电连接的材料和方法。 用于提供临时电连接的示例性材料可以包括导电膜或带，导电或导体填充的环氧树脂或基于RTV粘合剂的材料，浸渍有导电填料或非回流焊膏的水溶性材料。

公开(公告)号：US20070155029A1

公开(公告)日：2007-07-05

申请号：US11599194

申请日：2006-11-13

Applicant: Steven Hamren ,  Daniel Cram

Inventor： Steven Hamren ,  Daniel Cram

IPC: H01L21/66 ,  G01R31/26

CPC classification number: G01R1/0408 ,  G01R1/0433 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/321 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.

Abstract translation: 为半导体器件的处理和测试提供了改进的方法和设备。 一个实施例包括用于一个或多个具有非常细间距的电I / O（输入/输出）元件的半导体管芯的管芯载体。 半导体裸片以单一形式临时附接到模具载体，以便能够用常规接触技术测试骰子。 模具载体可以包括柔性电路基底基板和刚性支撑框架。 另外的实施例包括用于将半导体管芯附接到管芯载体并用于在测试期间提供与半导体管芯的临时电连接的材料和方法。 用于提供临时电连接的示例性材料可以包括导电膜或带，导电或导体填充的环氧树脂或基于RTV粘合剂的材料，浸渍有导电填料或非回流焊膏的水溶性材料。

公开(公告)号：US20050014301A1

公开(公告)日：2005-01-20

申请号：US10920014

申请日：2004-08-16

Applicant: Steven Hamren ,  Daniel Cram

Inventor： Steven Hamren ,  Daniel Cram

IPC: G01R1/04 ,  H05K3/32 ,  G01R31/26 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/66

CPC classification number: G01R1/0408 ,  G01R1/0433 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/321 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.