公开(公告)号：US20060076668A1

公开(公告)日：2006-04-13

申请号：US11244333

申请日：2005-10-06

Applicant: Sung-ki Kim

Inventor： Sung-ki Kim

IPC: H01L23/52 ,  H05K7/06

CPC classification number: H05K1/0216 ,  H05K1/0298 ,  H05K2201/0191 ,  H05K2201/09327

Abstract: A multi-layer PCB includes a first signal layer, a ground layer, a second signal layer, a third signal layer, an electric power layer, and a fourth signal layer, including a first insulating layer arranged between the first signal layer and the ground layer; a second insulating layer arranged between the ground layer and the second signal layer; a third insulating layer arranged between the second signal layer and the third signal layer; a fourth insulating layer arranged between the third signal layer and the electric power layer; and a fifth insulating layer arranged between the electric power layer and the fourth signal layer, wherein at least one of the first signal layer, the second signal layer, the third signal layer, and the fourth signal layer includes a pattern.

Abstract translation: 多层PCB包括第一信号层，接地层，第二信号层，第三信号层，电力层和第四信号层，包括布置在第一信号层和地之间的第一绝缘层 层; 布置在所述接地层和所述第二信号层之间的第二绝缘层; 布置在所述第二信号层和所述第三信号层之间的第三绝缘层; 布置在所述第三信号层和所述电力层之间的第四绝缘层; 以及布置在所述电力层和所述第四信号层之间的第五绝缘层，其中所述第一信号层，所述第二信号层，所述第三信号层和所述第四信号层中的至少一个包括图案。

公开(公告)号：US07237587B2

公开(公告)日：2007-07-03

申请号：US11244333

申请日：2005-10-06

Applicant: Sung-ki Kim

Inventor： Sung-ki Kim

IPC: H01K1/03

CPC classification number: H05K1/0216 ,  H05K1/0298 ,  H05K2201/0191 ,  H05K2201/09327

Abstract: A multi-layer PCB includes a first signal layer, a ground layer, a second signal layer, a third signal layer, an electric power layer, and a fourth signal layer, including a first insulating layer arranged between the first signal layer and the ground layer; a second insulating layer arranged between the ground layer and the second signal layer; a third insulating layer arranged between the second signal layer and the third signal layer; a fourth insulating layer arranged between the third signal layer and the electric power layer; and a fifth insulating layer arranged between the electric power layer and the fourth signal layer, wherein at least one of the first signal layer, the second signal layer, the third signal layer, and the fourth signal layer includes a pattern.

Abstract translation: 多层PCB包括第一信号层，接地层，第二信号层，第三信号层，电力层和第四信号层，包括布置在第一信号层和地之间的第一绝缘层 层; 布置在所述接地层和所述第二信号层之间的第二绝缘层; 布置在所述第二信号层和所述第三信号层之间的第三绝缘层; 布置在所述第三信号层和所述电力层之间的第四绝缘层; 以及布置在所述电力层和所述第四信号层之间的第五绝缘层，其中所述第一信号层，所述第二信号层，所述第三信号层和所述第四信号层中的至少一个包括图案。