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公开(公告)号:US20200208029A1
公开(公告)日:2020-07-02
申请号:US16639115
申请日:2018-08-03
Applicant: Sunstar Engineering Inc.
Inventor: Kazunobu TAKAMI , Takatomi NISHIDA
IPC: C09J163/04 , C08G59/24 , C08G59/68 , C08G59/50
Abstract: The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion.The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.
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公开(公告)号:US20230013387A1
公开(公告)日:2023-01-19
申请号:US17618939
申请日:2020-06-26
Applicant: Sunstar Engineering Inc.
Inventor: Takatomi NISHIDA , Kazuaki HANASAKI , Takashi MINAMIHORI
IPC: C08L63/00 , C08L33/08 , C08G18/80 , C08G59/50 , C09J175/08 , C08G18/32 , C08G18/58 , C08G18/48 , C08G18/76 , C08G18/10 , C08G18/64 , C08G18/28
Abstract: Disclosed is a low-temperature curable composition comprising: (A) at least one curable component selected from an epoxy resin and a blocked isocyanate, and (B) an amine-based latent curing agent, wherein a temperature peak of a reaction of the amine-based latent curing agent (B) with a bisphenol A type epoxy resin is between 70° C. and 110° C.
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公开(公告)号:US20190062611A1
公开(公告)日:2019-02-28
申请号:US16109917
申请日:2018-08-23
Applicant: Sunstar Engineering Inc. , Mazda Motor Corporation
Inventor: Takatomi NISHIDA , Shohei YANAGISAWA , Katsuya HIMURO , Kenichi YAMAMOTO , Motoyasu ASAKAWA , Tomoya YOSHIDA
IPC: C09J163/00 , C09J11/08
CPC classification number: C09J163/00 , C09J11/08 , C08L63/00
Abstract: The present invention provides a one-component type thermosetting adhesive composition used as an automotive structural adhesive having high damping performance without reducing adhesive strength and having excellent low-temperature curability and a body structure for vehicle, on which the one-component type thermosetting adhesive composition is applied. The present invention relates to a one-component type thermosetting adhesive composition comprising an epoxy resin and an amine-based latent curing agent, wherein the epoxy resin comprises: (1) a dibasic acid ester-based epoxy resin, (2) a butadiene-acrylonitrile copolymer modified epoxy resin, and (3) an unmodified bisphenol A type epoxy resin, and wherein a thermally cured product formed from the composition has: a loss tangent tan δ at 23° C. of not less than 0.2 as a damping performance, and a Young's modulus of not less than 50 MPa, and a body structure for vehicle, on which the one-component type thermosetting adhesive composition is applied.
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