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公开(公告)号：US20250109324A1
公开(公告)日：2025-04-03
申请号：US18835610
申请日：2023-01-24
Applicant: Sunstar Engineering Inc.
Inventor： Toshio KOBAYASHI , Tsuyoshi NAKATSUJI , Tatsuya OKUNO
IPC: C09J163/00 , C09J11/06 , C09J11/08
Abstract: Excellent adhesive strength can be maintained to improve product reliability, even after storage under high humidity, by a curing agent (B) for an epoxy resin, the curing agent (B) containing a reactive terminated polydiene (B1), a reactive polyamine (B2), and an amidine (B3).
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