公开(公告)号：US20200229296A1

公开(公告)日：2020-07-16

申请号：US16833744

申请日：2020-03-30

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Tomi SIMULA ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Pasi RAAPPANA ,  Minna PIRKONEN

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K5/06

Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

公开(公告)号：US20200229295A1

公开(公告)日：2020-07-16

申请号：US16245643

申请日：2019-01-11

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Tomi SIMULA ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Pasi RAAPPANA ,  Minna PIRKONEN

IPC: H05K1/02 ,  H05K1/18 ,  H05K5/06 ,  H05K3/28

Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.