-
公开(公告)号:US20180188651A1
公开(公告)日:2018-07-05
申请号:US15450036
申请日:2017-03-06
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor: Shih-Chang Lin , Yi-Ming Chen , Chiu-Feng Chen , Chun-Yi Kuo
CPC classification number: G03F7/0387 , C08G73/08 , C08G73/101 , C08G73/1042 , C08G73/1082 , C08G73/1085 , C09D179/08 , G03F7/027 , G03F7/029 , G03F7/031 , G03F7/038 , G03F7/0388 , G03F7/0751 , G03F7/085
Abstract: A photosensitive composition is provided. The photosensitive composition includes a composition for forming polyimide, a photoinitiator, a photo cross-linking agent, and a thermal cross-linking agent. The composition for forming polyimide includes a diamine monomer component, an anhydride monomer component, and a polyimide modifier. The diamine monomer component includes a long-chain aliphatic diamine monomer, a carboxylic acid-containing diamine monomer, and a triazole compound. The anhydride monomer component includes a dianhydride monomer and a monoanhydride monomer. The polyimide modifier has a double bond and an epoxy group.
-
公开(公告)号:US20190244927A1
公开(公告)日:2019-08-08
申请号:US15942583
申请日:2018-04-02
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor: Sheng-Chin Lin , Yao-Ming Wu , Yen-Hsiang Chen , Yi-Ming Chen
IPC: H01L23/00 , C09D5/34 , C09D179/08 , C08G73/10
CPC classification number: H01L24/29 , C08G73/1042 , C08G73/1082 , C08G73/1085 , C09D5/34 , C09D179/085 , H01L21/6836 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/02373 , H01L2224/0401 , H01L2224/05569 , H01L2224/05639 , H01L2224/05647 , H01L2224/05684 , H01L2224/12105 , H01L2224/16227 , H01L2224/27003 , H01L2224/2744 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/9221 , H01L2924/07025 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106
Abstract: A cover film includes a release layer and a polyimide layer disposed on the release layer. The polyimide layer includes an inner surface and an outer surface opposite to the inner surface. The outer surface is exposed to the atmosphere, and the polyimide layer is formed from a reaction of a polyimide composition made of diamine monomer and tetracarboxylic dianhydride monomer. The polyimide layer further includes a cross-linker and an initiator. The diamine monomer is an aliphatic diamine monomer with a number of carbon greater than or equal to 36. A lowest viscosity of the polyimide layer is less than 20000 Pa·s when polyimide layer is under a temperature in a range of 60° C. to 160° C.
-