公开(公告)号：US20150129288A1

公开(公告)日：2015-05-14

申请号：US14079191

申请日：2013-11-13

Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.

Inventor： Pen-Yi LIAO ,  Tsung-Han WU ,  Fu-Pin TANG ,  Mei-Chun CHEN ,  Yu-Jen CHOU

IPC: H05K1/02 ,  H05K1/03 ,  C25D5/02 ,  H05K1/09 ,  H05K3/46 ,  H05K3/00

CPC classification number: C25D5/02 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/1653 ,  C25D5/10 ,  H05K3/0026 ,  H05K3/0041 ,  H05K3/108 ,  H05K3/241 ,  H05K2201/0108 ,  H05K2201/0195 ,  H05K2201/0338 ,  H05K2201/09036 ,  H05K2203/054 ,  H05K2203/107

Abstract: A circuit substrate includes: a substrate; an insulating coating layered structure formed on the substrate, having top and bottom surfaces, and formed with a patterned recess that is indented inwardly from the top surface, that is disposed above the bottom surface, and that is defined by a recess-defining wall, the recess-defining wall having a bottom wall portion and a surrounding wall portion that extends upwardly from a periphery of the bottom wall portion; and a patterned metallic layered structure including an electroless plating metal layer formed on the bottom wall portion of the recess-defining wall.

Abstract translation: 电路基板包括：基板; 形成在所述基板上的绝缘涂层分层结构，具有顶表面和底表面，并且形成有从顶表面向内凹入的图案化凹部，其设置在底表面上方，并且由凹陷限定壁限定， 所述凹部限定壁具有从所述底壁部的周边向上延伸的底壁部和周壁部; 以及图案化的金属层状结构，其包括形成在凹陷限定壁的底壁部分上的化学镀金属层。