公开(公告)号：US20090034156A1

公开(公告)日：2009-02-05

申请号：US11830244

申请日：2007-07-30

Applicant: TAKUYA YAMAMOTO

Inventor： TAKUYA YAMAMOTO

IPC: H01G4/06 ,  H01B3/00

CPC classification number: H01G4/38 ,  B82Y10/00 ,  H01G4/33 ,  H05K1/162 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/0323

Abstract: Composite materials for the formation of printed circuit boards and electronic devices. A composite structure of the invention includes an electrically conductive layer and a dielectric layer. The dielectric layer includes a plurality of adjacent dielectric material patches arranged in a patchwork configuration, which patches are made up of different dielectric materials to thereby result in areas of differential capacitance.

Abstract translation: 用于形成印刷电路板和电子设备的复合材料。 本发明的复合结构包括导电层和电介质层。 电介质层包括以拼接配置布置的多个相邻的电介质材料片，所述贴片由不同的电介质材料构成，从而导致差分电容的区域。