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公开(公告)号：US11323046B2
公开(公告)日：2022-05-03
申请号：US16650014
申请日：2018-09-13
Applicant: TDK CORPORATION
Inventor： Atsushi Ezawa , Takuto Horii , Atsuko Murakoshi
Abstract: In a vibration unit, a piezoelectric element enters an internal space of a through hole; and thereby, a second case member can be arranged proximate to a first case member. Therefore, a thickness of the vibration unit can be reduced, namely, a height of the vibration unit can be reduced. As described above, since the thickness of the vibration unit is reduced, a size of the vibration unit can be reduced.
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