公开(公告)号：US20240161984A1

公开(公告)日：2024-05-16

申请号：US18485497

申请日：2023-10-12

Applicant: TDK CORPORATION

Inventor： Akira EBISAWA ,  Hideyuki KOBAYASHI ,  Takaaki MORITA

IPC: H01G9/028 ,  H01G9/012

CPC classification number: H01G9/028 ,  H01G9/012 ,  H01G2009/05

Abstract: A solid electrolytic capacitor includes: a valve metal support having an anode terminal region and a cathode forming region and forming an anode part; and a cathode part provided in a cathode forming region of the valve metal support. The cathode part includes: a solid electrolyte layer that is disposed on a surface of a dielectric layer provided at least on the cathode forming region of the valve metal support and contains a conductive polymer; a waterproof seed layer that is disposed on a surface of the solid electrolyte layer and contains a conductive material; and a metal plating layer disposed on a surface of the waterproof seed layer. A catalytic metal having catalytic activity for plating is provided on the surface of the waterproof seed layer.

公开(公告)号：US20240355554A1

公开(公告)日：2024-10-24

申请号：US18639569

申请日：2024-04-18

Applicant: TDK Corporation

Inventor： Takaaki MORITA ,  Hideyuki KOBAYASHI ,  Yusuke TAKAHASHI ,  Masaki OIKAWA ,  Tetsushi INOUE

IPC: H01G9/15 ,  H01G9/07

CPC classification number: H01G9/15 ,  H01G9/07

Abstract: A solid electrolytic capacitor according to one embodiment of the present disclosure may include a stacked body having a plurality of stacked solid electrolytic capacitor elements being stacked, a first side electrode arranged on a first side surface of the stacked body, and a second side electrode arranged on a second side surface of the stacked body. Each of the solid electrolytic capacitor elements may include an anode electrode layer, a dielectric layer, a cathode electrode layer, a solid electrolyte layer, and an insulating region arranged on the anode electrode layer and adjacent to a side of the solid electrolyte layer. The first distance between the anode electrode layer and the second side electrode may be smaller than the second distance between the insulating region and the second side electrode.

公开(公告)号：US20200321499A1

公开(公告)日：2020-10-08

申请号：US16794445

申请日：2020-02-19

Applicant: TDK CORPORATION

Inventor： Takasi SATOU ,  Susumu TANIGUCHI ,  Hideyuki KOBAYASHI ,  Makoto ORIKASA

IPC: H01L33/62 ,  H01L23/00

Abstract: A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.