COIL COMPONENT
    1.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号:US20240290529A1

    公开(公告)日:2024-08-29

    申请号:US18582739

    申请日:2024-02-21

    CPC classification number: H01F17/0013 H01F27/292

    Abstract: Disclosed herein is a coil component that includes plural conductor layers embedded in the element body, first and second bump conductors, and first and second dummy bump conductors. Each of the conductor layers includes a coil pattern, first and second connection patterns respectively connected to the first and second bump conductors, and first and second dummy connection patterns respectively connected to the first and second dummy bump conductors. The conductor layers include first and second conductor layers. The first dummy connection pattern included in each of the first and second conductor layers has a cutout part. At least a part of the outer peripheral end of the coil pattern included in each of the first and second conductor layers is disposed within the cutout part.

    COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20240186056A1

    公开(公告)日:2024-06-06

    申请号:US18525613

    申请日:2023-11-30

    CPC classification number: H01F27/2804 H01F27/324 H01F41/043 H01F41/12

    Abstract: Disclosed herein is a coil component that includes a magnetic element body, a coil pattern and a conductor post embedded in the magnetic element body, a post protective film provided between the conductor post and the magnetic element body, a cover insulating film covering a mounting surface of the magnetic element body, and a terminal electrode provided on the cover insulating film and connected to the conductor post through a first opening formed in the cover insulating film. The terminal electrode includes: a first conductor layer contacting the conductor post through the first opening and having a second opening through which a part of the conductor post is exposed; and a second conductor layer having a resistance value lower than the first conductive material, covering the first conductor layer, and contacting the part of the conductor post through the second opening.

    SURFACE-MOUNT ELECTRONIC COMPONENT AND CIRCUIT BOARD HAVING THE SAME

    公开(公告)号:US20230132354A1

    公开(公告)日:2023-04-27

    申请号:US17971137

    申请日:2022-10-21

    Abstract: Disclosed herein is a surface-mount electronic component that includes a main body part having a mounting surface, a first terminal electrode provided on one end side of the mounting surface in a long side direction thereof, and a second terminal electrode provided on other end side of the mounting surface in the long side direction thereof. Each of the first and second terminal electrode includes a main area extending in a short side direction of the mounting surface and a protruding part provided at a center portion in the short side direction so as to protrude from the main area to an end portion of the mounting surface in the long side direction.

    COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20230126614A1

    公开(公告)日:2023-04-27

    申请号:US17971177

    申请日:2022-10-21

    Abstract: Disclosed herein is a coil component that includes a coil part having a structure in which a plurality of conductor layers each having a coil pattern are stacked in a coil axis direction through a plurality of interlayer insulating films, a first magnetic layer covering the coil part in the coil axis direction, and a second magnetic layer positioned in an inner diameter area of the coil part. The plurality of interlayer insulating films include a first interlayer insulating film positioned closest to the first magnetic layer. The first and second magnetic layers contact each other through an opening formed in the first interlayer insulating film. The opening has a shape whose diameter increases as a distance from an interface between the first and second magnetic layers increases.

    COIL COMPONENT
    5.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号:US20180323003A1

    公开(公告)日:2018-11-08

    申请号:US15961101

    申请日:2018-04-24

    CPC classification number: H01F27/292 H01F27/2804 H01F27/323 H01F2027/2809

    Abstract: Disclosed herein is a coil component that includes a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, and an external terminal. Each of the conductor layers has a coil conductor pattern and an electrode pattern exposed from the coil part. The electrode patterns are connected to each other through a plurality of via conductors penetrating the interlayer insulating layers. At least one of the interlayer insulating layers is exposed from the coil part positioned between the plurality of electrode patterns. The external terminal is formed on the electrode patterns exposed from the coil part so as to avoid an exposed part of the interlayer insulating layer.

    COIL COMPONENT
    6.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号:US20230317358A1

    公开(公告)日:2023-10-05

    申请号:US18180510

    申请日:2023-03-08

    CPC classification number: H01F27/292 H01F27/32 H01F27/02

    Abstract: Disclosed herein is a coil component that includes a conductor layer including a coil pattern and a terminal pattern provided independently of the coil pattern and exposed from the magnetic element body. The terminal pattern includes a linear part having a substantially constant pattern width in a direction perpendicular to the side surface of the magnetic element body, a widened part positioned at one end side in a second direction. The outermost turn of the coil pattern includes a first section provided along the linear part, a second section provided along the widened part, and a fourth section provided along the magnetic element body and positioned on a side opposite to the first section with respect to the second section. The pattern width of the coil pattern is larger in the second sections than in the first and fourth sections.

    COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20230071379A1

    公开(公告)日:2023-03-09

    申请号:US17798496

    申请日:2021-02-10

    Abstract: To achieve a high inductance value while reducing the entire thickness in a coil component having a structure in which spiral coil patterns are stacked. A coil component includes: a coil part having a structure in which interlayer insulating films and spirally wound coil patterns are alternately stacked in the axial direction of the coil component; and magnetic element members embedding therein the coil part. The interlayer insulating film covering, from one end side in the axial direction, one coil pattern positioned at the one end in the axial direction is higher in permeability than the interlayer insulating films. Thus, the one coil pattern positioned at the end portion is covered with the interlayer insulating film having a high permeability, so that it is possible to achieve a high inductance value while reducing the entire thickness.

    COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20210005377A1

    公开(公告)日:2021-01-07

    申请号:US16642773

    申请日:2018-08-10

    Abstract: A coil component includes: a first magnetic resin layer in a lower area; a second magnetic resin layer in an inner diameter area surrounded by a coil pattern, an outer peripheral area that surrounds the coil pattern, and an upper area; and an insulating gap layer between the first and second magnetic resin layers. A part of the insulating gap layer positioned between the first magnetic resin layer and a part of the second magnetic resin layer positioned in the inner diameter area is curved in the axial direction. A magnetic substrate need not be used. The insulating gap layer is provided, allowing the insulating gap layer to function as a magnetic gap. The insulating gap layer is curved in the axial direction, so that a contact area between the insulating gap layer and the first and second magnetic resin layers are increased to enhance adhesion therebetween.

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20190066900A1

    公开(公告)日:2019-02-28

    申请号:US16100607

    申请日:2018-08-10

    Abstract: Disclosed herein is an electronic component that includes: a base having a main surface; a passive element part formed on the main surface of the base; a magnetic resin layer formed on the main surface of the base so as to embed the passive element part therein, the magnetic resin layer having a surface extending substantially parallel to the main surface of the base; an insulating coat layer formed on a first area of the surface of the magnetic resin layer, the insulating coat layer having higher smoothness than the surface of the magnetic resin layer; and a terminal electrode formed on a second area of the surface of the magnetic resin layer and electrically connected to the passive element part.

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