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公开(公告)号：US20160008930A1
公开(公告)日：2016-01-14
申请号：US14862607
申请日：2015-09-23
Applicant: TDK CORPORATION
Inventor： Tsutomu YASUI , Hisayuki ABE , Kenichi KAWABATA , Tomoko KITAMURA
CPC classification number: H05K3/3463 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/3033 , C22C13/00 , C22C19/03 , H01L2224/16225 , H01L2924/19105 , H05K3/3484
Abstract: First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.
Abstract translation: 第一焊料是不含铅（Pb）的无铅焊料。 第一焊料包括至少含有Sn的第一金属; 以及含有至少Ni-Fe合金的第二金属。
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公开(公告)号：US20160128196A1
公开(公告)日：2016-05-05
申请号：US14923831
申请日：2015-10-27
Applicant: TDK CORPORATION
Inventor： Tsutomu YASUI , Kenichi KAWABATA
CPC classification number: C22C19/03 , B23K35/262 , B23K35/3033 , C22C1/0433 , C22C1/0483 , C22C13/02 , H05K3/3463
Abstract: An electronic circuit module component includes: an electronic component; a circuit board including the electronic component mounted thereon; and a bonding metal disposed between a terminal electrode of the electronic component and a terminal electrode of the circuit board, and including Sn alloy phases, an Ni—Sn alloy phase that disperses and forms between the Sn alloy phases and includes at least Fe, and a plurality of holes that is formed inside the Ni—Sn alloy phase and has a diameter of 5 μm or less. A center distance between the holes adjacent to each other is 10 μm or more.
Abstract translation: 电子电路模块组件包括：电子部件; 包括安装在其上的电子部件的电路板; 以及配置在电子部件的端子电极和电路基板的端子电极之间的接合金属，并且包括Sn合金相，在Sn合金相之间分散形成并且至少包含Fe的Ni-Sn合金相，以及 形成在Ni-Sn合金相内部并具有5μm以下的直径的多个孔。 相邻的孔之间的中心距离为10μm以上。
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公开(公告)号：US20160121434A1
公开(公告)日：2016-05-05
申请号：US14923853
申请日：2015-10-27
Applicant: TDK CORPORATION
Inventor： Tsutomu YASUI , Kenichi KAWABATA
CPC classification number: B23K35/262 , B22F2998/10 , B23K35/0244 , C22C1/0433 , C22C1/0483 , C22C13/02 , C22C19/03 , H05K1/11 , H05K1/181 , H05K3/3463 , H05K3/3478 , H05K3/3494 , H05K2203/0415 , B22F1/0003 , B22F9/082 , B22F2201/01
Abstract: A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %. A ratio of the second metal to the sum of mass of the first metal and mass of the second metal is 5 to 30 mass %
Abstract translation: 无铅焊料包括至少包含Sn和Bi的第一金属和至少包含Ni-Fe合金的第二金属。 在第一金属中，Sn和Bi的总和为90质量％以上，Bi的比例为5〜15质量％。 第二金属与第一金属的质量和第二金属的质量之和的比例为5〜30质量％
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