公开(公告)号：US20160248141A1

公开(公告)日：2016-08-25

申请号：US15049834

申请日：2016-02-22

Applicant: TDK Corporation

Inventor： Toshiyasu FUJIWARA ,  Chengbin LIN ,  Takeshi OOHASHI ,  Yukio MITAKE

IPC: H01P5/18 ,  H04B1/44

CPC classification number: H01P5/18 ,  H01P5/184 ,  H04B1/44

Abstract: A directional coupler including a main line having an input terminal and an output terminal, and a sub-line having a coupling terminal and an isolation terminal, the main line, the sub-line, the input terminal, the output terminal, the coupling terminal and the isolation terminal being disposed within a laminate, wherein the main line and the sub-line extend in a loop shape in parallel with and spaced apart from each other by a gap such that electromagnetic coupling is generated therebetween and such that the main line is positioned outside the sub-line on a coupling layer, the input terminal, the output terminal, the coupling terminal and the isolation terminal are disposed outside the main line, and the main line is interposed between the output terminal and the sub-line.

Abstract translation: 一种定向耦合器，包括具有输入端和输出端的主线，以及具有耦合端子和隔离端子的子线，主线，子线，输入端，输出端，耦合端 并且所述隔离端子设置在层压体内，其中所述主线路和所述子线路以与所述主线路和所述子线路之间的间隔彼此平行并间隔开的环形延伸，使得在其间产生电磁耦合，并且所述主线路 位于耦合层的子线外侧，输入端子，输出端子，耦合端子和隔离端子配置在主线的外侧，主线插在输出端子与副线之间。

公开(公告)号：US20240069126A1

公开(公告)日：2024-02-29

申请号：US18548969

申请日：2022-02-22

Applicant: TDK Corporation

Inventor： Koji KUROKI ,  Chengbin LIN

IPC: G01R33/09

CPC classification number: G01R33/09

Abstract: A sensor chip of a magnetic sensor includes a magnetosensitive element, ferromagnetic films forming a magnetic gap overlapping the magnetosensitive element, and a passivation film provided on the ferromagnetic films so as to be filled in the magnetic gap. The ferromagnetic films each include a lower magnetic film and an upper magnetic film. The magnetic gap is configured such that a width between the upper magnetic films is larger than a width between the lower magnetic films. The material of the lower magnetic film is higher in permeability than the material of the upper magnetic film. With the above configuration, magnetic flux is efficiently applied to the magnetosensitive element, making it possible to achieve high detection sensitivity.

公开(公告)号：US20190293735A1

公开(公告)日：2019-09-26

申请号：US16302264

申请日：2017-05-22

Applicant: TDK CORPORATION

Inventor： Kentaro USHIODA ,  Makoto KAMENO ,  Chengbin LIN ,  Shuichi OKAWA

IPC: G01R33/09 ,  H01L43/08

Abstract: An object of the present invention is to enhance detection accuracy of a magnetic sensor having four bridge-connected magnetic sensing elements. A magnetic sensor includes magnetic layers 41-43 provided on a surface of the sensor substrate 20 and bridge-connected magnetic sensing elements R1-R4. The magnetic layer 41 includes a main area M1 and a converging area S1 having a width gradually reduced with increasing distance from the main area M1, the magnetic layer 42 includes a main area M2 and converging areas S5, S7 each having a width gradually reduced with increasing distance from the main area M2, and the magnetic layer 43 includes a main area M3 and converging areas S6, S8 each having a width gradually reduced with increasing distance from the main area M3. The end portions of the converging areas S1-S4 and the end portions of the converging areas S5-S8 face each other, respectively, through gaps G1-G4, respectively. The magnetic sensing elements R1-R4 are disposed on magnetic paths formed by the gaps G1-G4, respectively. According to the present invention, detection accuracy is enhanced because a magnetic flux generated by current flowing in one magnetic sensing element does not affect the other sensing element.

公开(公告)号：US20230258741A1

公开(公告)日：2023-08-17

申请号：US18107158

申请日：2023-02-08

Applicant: TDK CORPORATION

Inventor： Chengbin LIN ,  Takato FUKUI

IPC: G01R33/00

CPC classification number: G01R33/0017

Abstract: Disclosed herein is a magnetic sensor that includes first and second magnetic layers opposed to each other through a magnetic gap, a magnetosensitive element disposed on a magnetic path formed by the magnetic gap, and a compensating coil wound around the first and second magnetic layers. The first magnetic layer, second magnetic layer, magnetosensitive element, and compensating coil are integrated in a sensor chip.