公开(公告)号：US20170301628A1

公开(公告)日：2017-10-19

申请号：US15465177

申请日：2017-03-21

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA ,  Toshio HAYAKAWA ,  Toshiro OKUBO

IPC: H01L23/552 ,  H01L21/78 ,  H01L23/31 ,  H01L21/3205 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/32051 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05442 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/014

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a laminated structure of a magnetic film and a metal film, the laminated structure covering at least an upper surface of the molding resin. The metal film is connected to the power supply pattern, and a resistance value at an interface between the magnetic film and the metal film is equal to or larger than 106Ω.

公开(公告)号：US20170309576A1

公开(公告)日：2017-10-26

申请号：US15464775

申请日：2017-03-21

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA ,  Toshio HAYAKAWA ,  Toshiro OKUBO

IPC: H01L23/552 ,  H01L21/78 ,  H01L23/31 ,  H01L21/3205 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/32051 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05442 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2224/81

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed of a composite magnetic material obtained by dispersing magnetic fillers in a thermosetting resin material, the magnetic film covering upper and side surfaces of the molding resin and an edge portion of the front surface exposed to aside surface of the substrate; and a metal film connected to the power supply pattern and covering the molding resin through the magnetic film.

公开(公告)号：US20170294387A1

公开(公告)日：2017-10-12

申请号：US15381379

申请日：2016-12-16

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA ,  Toshio HAYAKAWA ,  Toshiro OKUBO

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein and has a concave portion above the first region, a magnetic film selectively provided in the concave portion, and a first metal film that is connected to the power supply pattern and covers the mold resin.

公开(公告)号：US20230380122A1

公开(公告)日：2023-11-23

申请号：US18317468

申请日：2023-05-15

Applicant: TDK Corporation

Inventor： Toshiro OKUBO ,  Shun KUDO ,  Kazuki ONUMA

IPC: H05K9/00 ,  H01B7/18

CPC classification number: H05K9/0088 ,  H01B7/1875 ,  H05K9/0098

Abstract: Disclosed herein is a noise suppression sheet that includes a first magnetic layer. The first magnetic layer includes a plurality of first regions stacked in a thickness direction of the noise suppression sheet and a second region positioned between the first regions. The first magnetic layer includes a first metal component of Ni, a second metal component of Fe, and a third metal component other than Ni and Fe. The concentration of the third metal component in the second region is higher than the concentration of the third metal component in the first regions.

公开(公告)号：US20170278804A1

公开(公告)日：2017-09-28

申请号：US15351758

申请日：2016-11-15

Applicant: TDK Corporation

Inventor： KENICHI KAWABATA ,  Toshio HAYAKAWA ,  Toshiro OKUBO

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/29 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L23/29 ,  H01L23/3135 ,  H01L23/49805 ,  H01L23/564 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed so as to contact at least a top surface of the mold resin; and a metal film electrically connected to the power supply pattern and covering the mold resin through the magnetic film.