公开(公告)号：US20240145432A1

公开(公告)日：2024-05-02

申请号：US18549307

申请日：2022-03-01

Applicant: TESLA, INC.

Inventor： Mengzhi Pang ,  Yang Sun ,  Yong guo Li ,  Jianjun Li ,  Rodrigo Rodriguez Navarrete ,  Vijaykumar Krithivasan ,  Rishabh Bhandari

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552 ,  H01L23/60

CPC classification number: H01L25/0652 ,  H01L23/3672 ,  H01L23/552 ,  H01L23/60 ,  H01L24/48 ,  H01L24/16 ,  H01L2224/16221 ,  H01L2224/48245

Abstract: The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.