公开(公告)号：US20210376179A1

公开(公告)日：2021-12-02

申请号：US16884812

申请日：2020-05-27

Applicant: Texas Instruments Incorporated

Inventor： Eduardo Bartolome ,  Rakul Viswanath

IPC: H01L31/09 ,  H01L31/08

Abstract: In a described example, an apparatus includes: a photon detector array with a first signal output pad coupled to a photon detector array pixel; a die carrier comprising a readout integrated circuit (ROIC) die and a conductor layer having conductors that couple a first signal input pad on the conductor layer to an input signal lead of the ROIC die; and the first signal output pad coupled to the first signal input pad.

公开(公告)号：US20140270057A1

公开(公告)日：2014-09-18

申请号：US14187905

申请日：2014-02-24

Applicant: Texas Instruments Incorporated

Inventor： Eduardo Bartolome ,  Sreenivasan K. Koduri

IPC: G01N23/04 ,  H01L31/0232 ,  H01L21/66 ,  H05G1/08 ,  G01T1/16

CPC classification number: G01N23/046 ,  G01N2223/419 ,  G01T1/2018 ,  H01L22/10 ,  H01L27/14661 ,  H01L27/1469

Abstract: An apparatus having an X-ray sensor assembly with X-ray blocking pixels divided by X-ray transmitting gaps with the X-ray blocking pixels casting an X-ray blocking shadow; and a die containing signal processing electronics, with the signal processing electronics positioned substantially entirely within the X-ray blocking shadow. A method for detecting the alignment between the X-ray sensor assembly and the die is disclosed. Also disclosed is an X-ray computed tomography machine having a printed circuit board (“PCB”), a die embedded in the PCB, and a signal source wherein signals are routed to and from the die by traces on at least one of the surfaces of the PCB.

Abstract translation: 一种具有X射线遮挡像素的X射线传感器组件的X射线传感器组件的装置，X射线遮挡像素被X射线透射间隙除以X射线遮挡像素投射X射线遮挡阴影; 以及包含信号处理电子器件的管芯，信号处理电子器件基本上完全位于X射线阻挡阴影内。 公开了一种用于检测X射线传感器组件和模具之间的对准的方法。 还公开了一种X射线计算机断层摄影机，其具有印刷电路板（“PCB”），嵌入在PCB中的管芯，以及信号源，其中信号通过至少一个表面上的迹线被引导到管芯和从管芯 的PCB。

公开(公告)号：US20240106404A1

公开(公告)日：2024-03-28

申请号：US17955503

申请日：2022-09-28

Applicant: Texas Instruments Incorporated

Inventor： Nagesh Surendranath ,  Eduardo Bartolome ,  Saugata Datta

IPC: H03G1/04 ,  H03F1/26 ,  H03F3/45 ,  H03G3/30

CPC classification number: H03G1/04 ,  H03F1/26 ,  H03F3/45475 ,  H03G3/3031

Abstract: A circuit includes a plurality of first stage integrators. Each of the plurality of first stage integrators includes a first input, a second input, a third input and an output. The first input of each of the plurality of first stage integrators is coupled to a different one of circuit inputs, the second input is coupled to a first reference input, the third input is coupled to a second reference input and the output of each of the plurality of first stage integrators is coupled to the first input of such first stage integrator. The circuit includes a second stage integrator which includes a first input coupled to each of the first inputs of the plurality of first stage integrators, a second input coupled to the first reference input, and an output coupled to the first input of the second stage integrator.

公开(公告)号：US20230275176A1

公开(公告)日：2023-08-31

申请号：US18312948

申请日：2023-05-05

Applicant: Texas Instruments Incorporated

Inventor： Eduardo Bartolome ,  Rakul Viswanath

IPC: H01L31/09 ,  H01L31/08 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L27/146

CPC classification number: H01L31/09 ,  H01L31/085 ,  H01L24/19 ,  H01L21/568 ,  H01L21/4846 ,  H01L27/14658 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/14645 ,  H01L27/14634 ,  H01L31/18

Abstract: In a described example, an apparatus includes: a photon detector array with a first signal output pad coupled to a photon detector array pixel; a die carrier comprising a readout integrated circuit (ROIC) die and a conductor layer having conductors that couple a first signal input pad on the conductor layer to an input signal lead of the ROIC die; and the first signal output pad coupled to the first signal input pad.

公开(公告)号：US09684066B2

公开(公告)日：2017-06-20

申请号：US14518800

申请日：2014-10-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Eduardo Bartolome ,  Fernando Alberto Mujica ,  Sandeep Oswal ,  Abhaya Kumar

IPC: G01C3/08 ,  G01S7/486 ,  G01S17/10

CPC classification number: G01S7/4861 ,  G01S7/4865 ,  G01S17/10

Abstract: Samples of a light radar (“LIDAR”) return signal are stored in an analog circular buffer following the transmission of a LIDAR pulse. Sampling continues for a fixed period of time or number of samples during a post-trigger sampling period after the occurrence of a trigger signal from a trigger circuit. The trigger circuit indicates the receipt of a return pulse associated with a target object based upon one or more return signal characteristics. Following the post-trigger sampling period, the stored analog samples are sequentially read out and converted to digital sample values. The digital sample values may be analyzed in a digital processor to further confirm the validity of the returned LIDAR pulse, to determine a time of arrival of the LIDAR pulse, and to calculate a distance to the target object. Some versions include multiple circular buffers and capture clocks, enabling the capture of samples from multiple return pulses.

公开(公告)号：US20150116695A1

公开(公告)日：2015-04-30

申请号：US14518800

申请日：2014-10-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Eduardo Bartolome ,  Fernando Alberto Mujica ,  Sandeep Oswal ,  Abhaya Kumar

IPC: G01S17/10

CPC classification number: G01S7/4861 ,  G01S7/4865 ,  G01S17/10

Abstract: Samples of a light radar (“LIDAR”) return signal are stored in an analog circular buffer following the transmission of a LIDAR pulse. Sampling continues for a fixed period of time or number of samples during a post-trigger sampling period after the occurrence of a trigger signal from a trigger circuit. The trigger circuit indicates the receipt of a return pulse associated with a target object based upon one or more return signal characteristics. Following the post-trigger sampling period, the stored analog samples are sequentially read out and converted to digital sample values. The digital sample values may be analyzed in a digital processor to further confirm the validity of the returned LIDAR pulse, to determine a time of arrival of the LIDAR pulse, and to calculate a distance to the target object. Some versions include multiple circular buffers and capture clocks, enabling the capture of samples from multiple return pulses.

Abstract translation: 在发送LIDAR脉冲之后，光雷达（“LIDAR”）返回信号的样本被存储在模拟循环缓冲器中。 在从触发电路发生触发信号之后的后触发采样周期中，采样持续一段固定的时间或采样数。 触发电路基于一个或多个返回信号特征指示接收与目标对象相关联的返回脉冲。 在触发后采样周期之后，存储的模拟采样被依次读出并转换为数字采样值。 可以在数字处理器中分析数字样本值，以进一步确认返回的LIDAR脉冲的有效性，以确定LIDAR脉冲的到达时间，并计算到目标对象的距离。 一些版本包括多个循环缓冲器和捕获时钟，可以捕获来自多个返回脉冲的采样。

公开(公告)号：US11682745B2

公开(公告)日：2023-06-20

申请号：US16884812

申请日：2020-05-27

Applicant: Texas Instruments Incorporated

Inventor： Eduardo Bartolome ,  Rakul Viswanath

IPC: H01L31/09 ,  H01L23/00 ,  H01L27/146 ,  H01L31/08 ,  H01L21/56 ,  H01L21/48 ,  H01L31/18

CPC classification number: H01L31/09 ,  H01L21/4846 ,  H01L21/568 ,  H01L24/19 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14645 ,  H01L27/14649 ,  H01L27/14658 ,  H01L31/085 ,  H01L31/18

Abstract: In a described example, an apparatus includes: a photon detector array with a first signal output pad coupled to a photon detector array pixel; a die carrier comprising a readout integrated circuit (ROIC) die and a conductor layer having conductors that couple a first signal input pad on the conductor layer to an input signal lead of the ROIC die; and the first signal output pad coupled to the first signal input pad.

公开(公告)号：US09354186B2

公开(公告)日：2016-05-31

申请号：US14187905

申请日：2014-02-24

Applicant: Texas Instruments Incorporated

Inventor： Eduardo Bartolome ,  Sreenivasan K. Koduri

IPC: G01N23/04 ,  H01L21/66 ,  G01T1/20 ,  H01L27/146

CPC classification number: G01N23/046 ,  G01N2223/419 ,  G01T1/2018 ,  H01L22/10 ,  H01L27/14661 ,  H01L27/1469

Abstract: An apparatus having an X-ray sensor assembly with X-ray blocking pixels divided by X-ray transmitting gaps with the X-ray blocking pixels casting an X-ray blocking shadow; and a die containing signal processing electronics, with the signal processing electronics positioned substantially entirely within the X-ray blocking shadow. A method for detecting the alignment between the X-ray sensor assembly and the die is disclosed. Also disclosed is an X-ray computed tomography machine having a printed circuit board (“PCB”), a die embedded in the PCB, and a signal source wherein signals are routed to and from the die by traces on at least one of the surfaces of the PCB.

Abstract translation: 一种具有X射线遮挡像素的X射线传感器组件的X射线传感器组件的装置，X射线遮挡像素被X射线透射间隙除以X射线遮挡像素投射X射线遮挡阴影; 以及包含信号处理电子器件的管芯，信号处理电子器件基本上完全位于X射线阻挡阴影内。 公开了一种用于检测X射线传感器组件和模具之间的对准的方法。 还公开了一种X射线计算机断层摄影机，其具有印刷电路板（“PCB”），嵌入在PCB中的管芯，以及信号源，其中信号通过至少一个表面上的迹线被引导到管芯和从管芯 的PCB。