公开(公告)号：US20190109104A1

公开(公告)日：2019-04-11

申请号：US16107545

申请日：2018-08-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： NAZILLA DADVAND ,  HELMUT RINCK

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78

Abstract: A system and method for bonding an electrically conductive mechanical interconnector (e.g., a bonding wire, solder, etc.) to an electrical contact (e.g., contact pad, termination on a printed circuit board (PCB), etc.) made from an electrically conductive metal (e.g., aluminum) on an electronic device (e.g., integrated circuit (IC), die, wafer, PCB, etc.) is provided. The electrical contact is chemically coated with a metal (e.g., cobalt) that provides a protective barrier between the mechanical interconnector and the electrical contact. The protective barrier provides a diffusion barrier to inhibit galvanic corrosion (i.e. ion diffusion) between the mechanical interconnector and the electrical contact.