公开(公告)号：US20250112133A1

公开(公告)日：2025-04-03

申请号：US18478087

申请日：2023-09-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Huo Yun DUAN ,  Tian Sheng CHEN ,  Hang YAN ,  Qin PENG ,  Xiangrui LI

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: In examples, a method for manufacturing a package comprises coupling first and second semiconductor dies to a first surface of a conductive terminal; applying a dry film to a second surface of the conductive terminal opposite the first surface; removing a portion of the dry film contacting the second surface to form a dry film opening, the dry film opening having a linear, non-curved edge extending along a width of the conductive terminal; etching the second surface through the dry film opening; removing the dry film; plating the second surface; and sawing through the conductive terminal to form the package.