公开(公告)号：US09850577B1

公开(公告)日：2017-12-26

申请号：US15227781

申请日：2016-08-03

Applicant: TFD TECHNOLOGY CO., LTD.

Inventor： Chun-Chieh Huang

IPC: B05C3/04 ,  B05C3/09 ,  C23C18/16 ,  C23C18/54 ,  B05C3/08 ,  C25D17/18 ,  C25D17/22 ,  C25D17/24 ,  C25D17/20 ,  C25D17/16

CPC classification number: C23C18/1619 ,  B05C3/08 ,  B05C3/09 ,  C23C18/54 ,  C25D17/16 ,  C25D17/18 ,  C25D17/20 ,  C25D17/22 ,  C25D17/24

Abstract: A metal plating apparatus for plating metal with zinc is provided with a rotating device and a plurality of stirring devices. The rotating device has a driving assembly and a rotating assembly. The driving assembly has a driving gear. The rotating assembly is connected with and controlled by the driving assembly. The rotating assembly has a sustaining pillar. A rotating seat is mounted on the sustaining pillar and engaged with the driving gear. The stirring devices is mounted on the rotating seat radially and spaced from each other. The metal plating apparatus improves productivity through an automatic process which shifts locations of the stirring devices by the rotating device and plates metal with a cooperation of peripheral supporting apparatus, and improves working efficiency through decreasing occupied space and the number of operating personnel.