公开(公告)号：US10912608B2

公开(公告)日：2021-02-09

申请号：US15574758

申请日：2016-06-06

Applicant: The Hong Kong University of Science and Technology

Inventor： David Chuen Chun Lam ,  Chi Hang Chon ,  John Ching Kwong Kwok ,  Matthew Ming Fai Yuen ,  Zhen Qin ,  Alexander Ka Ngai Lam

IPC: A61B18/12 ,  A61B18/14 ,  A61B17/221 ,  A61B17/22 ,  A61B18/00

Abstract: A device is designed to remove blockages in a lumen such as a thrombus, blood clot, or embolus. The device comprises a manipulating wire and a structure that can conduct electrical current to a lumen blockage. The electrical current is preferably in radio frequency (RF). The RF electric current in the blockage can excite the contents such as proteins of the blockage, so that cross-linking density and interfacial adsorption of the entire blockage is enhanced. The enhanced cross-linking density can result in increased fracture resistance of the blockage such that fracture of the blockage during the removal process is unlikely. The enhanced interfacial adsorption results in increased interfacial fracture resistance between the device and blockage so that the blockage can be securely captured during the removal process without using radially applied force.

公开(公告)号：US20180361727A1

公开(公告)日：2018-12-20

申请号：US16060652

申请日：2016-12-09

Applicant: The Hong Kong University of Science and Technology

Inventor： George Alexandru Tilita ,  Wenhao Chen ,  Chi Fong Kwan ,  Matthew Ming Fai Yuen

IPC: B33Y10/00 ,  B33Y70/00 ,  B33Y30/00 ,  B29C64/153 ,  G06F17/50

Abstract: Embodiments disclosed herein represent powder based additive manufacturing processes which provide a microstructure having improved mechanical properties. The methods may include the use of ultrasonic excitation in combination with the active control of a substrate's temperature to provide some level of control over the microstructure and hence the properties.

公开(公告)号：US09605193B2

公开(公告)日：2017-03-28

申请号：US14057233

申请日：2013-10-18

Applicant: The Hong Kong University of Science and Technology

Inventor： Matthew Ming Fai Yuen ,  Xinfeng Zhang ,  Kan Kan Yeung ,  Zhaoli Gao ,  Kai Zhang ,  Min Zhang ,  Huansu Xu

IPC: C09K5/14 ,  C01B31/04 ,  H01L23/373 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: C09K5/14 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/182 ,  C01B32/23 ,  H01L23/373 ,  H01L2924/0002 ,  Y10T156/10 ,  Y10T428/265 ,  Y10T428/30 ,  H01L2924/00

Abstract: A thermal interface material provides thermal conduction or thermal dissipation across an interface, using a three-dimensional interconnected porous graphene (3D-IPG) foam structure. The 3D-IPG foam structure is constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers, and having an flexible interconnection architecture. The flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, and by capping small features up to nanoscale roughened surfaces.

公开(公告)号：US11534960B2

公开(公告)日：2022-12-27

申请号：US16060652

申请日：2016-12-09

Applicant: The Hong Kong University of Science and Technology

Inventor： George Alexandru Tilita ,  Wenhao Chen ,  Chi Fong Kwan ,  Matthew Ming Fai Yuen

IPC: B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/264 ,  G06F30/00 ,  B22F12/00 ,  B22F10/20 ,  B33Y70/00 ,  B22F10/10

Abstract: Embodiments disclosed herein represent powder based additive manufacturing processes which provide a microstructure having improved mechanical properties. The methods may include the use of ultrasonic excitation in combination with the active control of a substrate's temperature to provide some level of control over the microstructure and hence the properties.

公开(公告)号：US20180140354A1

公开(公告)日：2018-05-24

申请号：US15574758

申请日：2016-06-06

Applicant: The Hong Kong University of Science and Technology

Inventor： David Chuen Chun Lam ,  Chi Hang Chon ,  John Ching Kwong Kwok ,  Matthew Ming Fai Yuen ,  Zhen Qin ,  Alexander Ka Ngai Lam

IPC: A61B18/14 ,  A61B17/221

CPC classification number: A61B18/1492 ,  A61B17/221 ,  A61B2017/22034 ,  A61B2018/00214 ,  A61B2018/00267 ,  A61B2018/00398 ,  A61B2018/00404 ,  A61B2018/0041 ,  A61B2018/144 ,  A61B2018/1475

Abstract: A device is designed to remove blockages in a lumen such as a thrombus, blood clot, or embolus. The device comprises a manipulating wire and a structure that can conduct electrical current to a lumen blockage. The electrical current is preferably in radio frequency (RF). The RF electric current in the blockage can excite the contents such as proteins of the blockage, so that cross-linking density and interfacial adsorption of the entire blockage is enhanced. The enhanced cross-linking density can result in increased fracture resistance of the blockage such that fracture of the blockage during the removal process is unlikely. The enhanced interfacial adsorption results in increased interfacial fracture resistance between the device and blockage so that the blockage can be securely captured during the removal process without using radially applied force.

公开(公告)号：US09237646B2

公开(公告)日：2016-01-12

申请号：US13891913

申请日：2013-05-10

Applicant: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY

Inventor： Matthew Ming Fai Yuen ,  Xinfeng Zhang ,  Wayman Ngai Man Wong

IPC: H05K1/09 ,  H05K3/10 ,  B82Y99/00 ,  B82Y30/00

CPC classification number: H05K1/097 ,  B82Y30/00 ,  B82Y99/00 ,  H05K1/09 ,  H05K3/10 ,  H05K2201/0338

Abstract: A conductive thin film device includes a substrate and a thin film structure applied to the substrate. The thin film structure is applied as a first layer and forms a one-dimensional nanomaterial networked layer deposited on the substrate. A coating layer overlays the one-dimensional nanomaterial networked layer and can be made from graphene or graphene oxide. The coating layer at least partially covers the nanomaterial networked layer, thereby forming the device as a double-layer structure.

Abstract translation: 导电薄膜器件包括衬底和施加到衬底的薄膜结构。 将薄膜结构作为第一层施加，并形成沉积在基板上的一维纳米材料网络层。 涂层覆盖一维纳米材料网络层，并且可以由石墨烯或氧化石墨烯制成。 涂层至少部分地覆盖纳米材料网络层，从而将该装置形成为双层结构。

公开(公告)号：US20150289892A1

公开(公告)日：2015-10-15

申请号：US14443837

申请日：2013-11-20

Applicant: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY

Inventor： David Chuen Chun Lam ,  Chi Hang Chon ,  John Ching Kwong Kwok ,  Matthew Ming Fai Yuen ,  Zhen Qin ,  Alexander Ka Ngai Lam ,  Ka Kit Leung ,  Wai Lun Ko

IPC: A61B17/22 ,  A61B18/06 ,  A61B18/18 ,  A61B17/221 ,  A61B18/08 ,  A61B18/14

CPC classification number: A61B17/22 ,  A61B17/22031 ,  A61B17/221 ,  A61B18/06 ,  A61B18/08 ,  A61B18/14 ,  A61B18/1815 ,  A61B2018/00083 ,  A61B2018/00101 ,  A61B2018/00107 ,  A61B2018/00404 ,  A61B2018/00446 ,  A61B2018/1861

Abstract: The claimed biocompatible device is designed to remove vessel occlusions such as a thrombus, blood clot, or embolus. The claimed devices maybe used to treat occlusions in the brain, in the vasculature, and in tissues and organs.The device is in a form of a wire or wire-like structure which can capture the occlusion with minimal contact force with the vessel wall by an application of electricity, or electrical, chemical, or microwave generated heat to enable capture of the occlusion by the device. The device, compared to conventional mechanical thrombectomy devices, captures the occlusion and reduces occlusion fragmentation without large radial force and vessel wall friction that can damage the vessel wall.

Abstract translation: 所要求保护的生物相容性装置设计用于去除血管闭塞如血栓，血块或栓塞。 所要求的装置可用于治疗大脑，血管系统和组织和器官中的闭塞。 该装置是线或线状结构的形式，其可以通过施加电力或电，化学或微生物产生的热量以最小的接触力与血管壁捕获闭塞，以使得能够捕获闭塞 设备。 与常规机械性血栓切除装置相比，该装置捕获闭塞并减少闭塞断裂，而不会有大的径向力和血管壁摩擦，从而损伤血管壁。