公开(公告)号：US20160159641A1

公开(公告)日：2016-06-09

申请号：US14251972

申请日：2014-04-14

Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN

Inventor： Khalil NAJAFI ,  Sang-Hyun LEE ,  Sang Woo LEE ,  Jay Stewart MITCHELL ,  Onnop SRIVANNAVIT

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B7/0064 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0278 ,  B81B2207/07 ,  B81B2207/096 ,  B81C3/005 ,  B81C2203/031 ,  B81C2203/035 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/00

Abstract: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.