公开(公告)号：US20250113475A1

公开(公告)日：2025-04-03

申请号：US18953890

申请日：2024-11-20

Applicant: TOPPAN HOLDINGS INC

Inventor： Atsuko AOKI ,  Shinpei KONDO ,  Toru FUJITA ,  Miho IMAI ,  Ryosuke KOTAKA

IPC: H05K9/00

Abstract: A electromagnetic wave attenuation film includes a substrate provided with a dielectric substrate having a front surface and a back surface, and thin film conductive layers arranged on both the front surface and the back surface of the electromagnetic wave attenuation substrate; a support layer arranged on the back surface of the electromagnetic wave attenuation substrate; and a flat plate inductor arranged on the back surface of the support layer; wherein the thin film conductive layers include a plurality of conductive elements. Furthermore, the conductive elements are arranged periodically, and when a distance in a plane direction between a center of gravity of the conductive elements on the front surface and the back surface is 1, and a shortest distance from the center of gravity of the conductive elements to a plate end portion is a, equation (1) below may be satisfied. I≤5.2a . . . (1)