公开(公告)号：US20220411153A1

公开(公告)日：2022-12-29

申请号：US17777766

申请日：2020-11-16

Applicant: TOPPAN INC.

Inventor： Aki NAGAI ,  Ryo TANAKA ,  Hitomi FUKUTAKE ,  Hiroyuki WAKABAYASHI

IPC: B65D65/40 ,  B65D65/42 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32

Abstract: A method for manufacturing a packaging body according to the present disclosure includes the steps of: (A) preparing a packaging material that includes an innermost layer containing a resin composition containing a polypropylene resin and a filler dispersed in the resin composition, a ratio Y/X of an average particle diameter Y μm of the filler to a thickness X μm of the innermost layer being 0.02 to 3.5; (B) producing a packaging body that has the packaging material and an oil-in-water dispersion-type content hermetically housed by the packaging material; and (C) subjecting the packaging body to a heating treatment so as to absorb oil contained in the content into the innermost layer.