公开(公告)号：US20190147314A1

公开(公告)日：2019-05-16

申请号：US16247325

申请日：2019-01-14

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Tetsuya TSUKADA ,  Shonosuke MIZOGUCHI ,  Eriko HATAKEYAMA

IPC: G06K19/077

Abstract: A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.

公开(公告)号：US20160104064A1

公开(公告)日：2016-04-14

申请号：US14973457

申请日：2015-12-17

Applicant: Toppan Printing Co., Ltd.

Inventor： Shonosuke MIZOGUCHI ,  Tetsuya TSUKADA ,  Eriko HATAKEYAMA

IPC: G06K19/077 ,  H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/522 ,  H01L23/00

CPC classification number: G06K19/07747 ,  G06K19/07775 ,  G06K19/07779 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49827 ,  H01L23/49855 ,  H01L23/5227 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48225 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754

Abstract: An IC module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an IC chip provided to the first surface, having a contact communication function and a contactless communication function, and having two terminals formed thereon; a connecting coil formed on the first surface and having two ends; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first and second through holes, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the IC chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the IC chip.

Abstract translation: 本发明的IC模块包括：具有第一表面和第二表面的片状基底，具有第一通孔和与第一通孔间隔开的第二通孔; 设置在所述第一表面上的IC芯片，具有接触通信功能和非接触通信功能，并且其上形成有两个端子; 形成在第一表面上并具有两端的连接线圈; 接触端子部分，设置在所述第二表面上并被构造成接触外部接触机器; 设置在与第一和第二通孔重叠的位置处并与接触端子部分电绝缘的第二表面的桥接线; 插入穿过第一通孔并将IC芯片的第一端子连接到桥接线的第一导线; 插入穿过第二通孔并将桥接线连接到连接线圈的第一端的第二导线; 以及将连接线圈的第二端连接到IC芯片的第二端子的第三导线。

公开(公告)号：US20160104065A1

公开(公告)日：2016-04-14

申请号：US14973399

申请日：2015-12-17

Applicant: Toppan Printing Co., Ltd.

Inventor： Tetsuya TSUKADA ,  Shonosuke MIZOGUCHI ,  Eriko HATAKEYAMA

IPC: G06K19/077

Abstract: A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.

Abstract translation: 本发明的双IC卡包括：具有与外部机器接触的接触端子部分的IC模块，通过电磁耦合构成非接触端子部分的连接线圈和具有接触通信功能和非接触通信功能的IC芯片; 沿着线圈布线路径形成的天线，其形成电感并具有与所述IC模块的所述连接线圈电磁耦合的耦合线圈部，沿着线圈布线路径形成的主线圈部，所述线圈布线路径限定电感并连接到所述耦合线圈部 用于与外部机器执行非接触式通信，以及设置在形成所述耦合线圈部分和所述主线圈部分中的至少一个的所述线圈布线路径的部分中的电阻增加部分增加所述部分中的电阻; 以及布置天线的板状卡体。