公开(公告)号：US20170273197A1

公开(公告)日：2017-09-21

申请号：US15614335

申请日：2017-06-05

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Takanori OHARA ,  Kyoichi YAMAMOTO ,  Kentaro KUBOTA ,  Kenji HAYASHI

IPC: H05K3/46 ,  H05K1/09 ,  H05K3/10 ,  H05K1/16 ,  H05K3/38 ,  H05K3/22 ,  H05K3/20 ,  H05K3/24 ,  H05K3/12 ,  H05K3/32

CPC classification number: H05K1/028 ,  H05K1/0284 ,  H05K1/0386 ,  H05K1/092 ,  H05K1/095 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/103 ,  H05K3/12 ,  H05K3/1275 ,  H05K3/207 ,  H05K3/22 ,  H05K3/245 ,  H05K3/32 ,  H05K3/38 ,  H05K3/4046 ,  H05K3/4664 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K2203/302

Abstract: An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.