公开(公告)号：US20190245165A1

公开(公告)日：2019-08-08

申请号：US16385951

申请日：2019-04-16

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Wataru IJUIN ,  Satoshi SASAKI ,  Masayoshi SUZUTA

IPC: H01M2/02 ,  H01M2/08 ,  H01G11/80 ,  H01G11/84

CPC classification number: H01M2/0287 ,  B32B27/36 ,  H01G11/78 ,  H01G11/80 ,  H01G11/84 ,  H01M2/02 ,  H01M2/028 ,  H01M2/0285 ,  H01M2/08 ,  Y02E60/13

Abstract: A power storage device packaging material having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. The substrate layer is formed of a polyester film exhibiting ΔA, as expressed by the following formula, of 10% or more and a 50% elongation stress of 75 MPa or more after heat treatment at 160° C.: “ΔA=(break elongation after 160° C. heat treatment)−(break elongation before 160° C. heat treatment)”.

公开(公告)号：US20210057683A1

公开(公告)日：2021-02-25

申请号：US17093514

申请日：2020-11-09

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Satoshi SASAKI ,  Takuya MURAKI ,  Naoto OONO

IPC: H01M2/02 ,  H01M10/0525

Abstract: A packaging material for a power storage device having a laminate structure in the following order including a substrate layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and an inner layer containing a polyester-based resin. The inner layer has a melting peak temperature during melting in a range of 160 to 280° C. which is measured by a differential scanning calorimeter. The substrate layer has a melting peak temperature that is higher than the melting peak temperature of the inner layer.

公开(公告)号：US20180219192A1

公开(公告)日：2018-08-02

申请号：US15922417

申请日：2018-03-15

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Wataru IJUIN ,  Satoshi SASAKI

IPC: H01M2/02 ,  H01G11/78 ,  H01G11/84 ,  H01M10/0525 ,  B32B7/12 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B27/16 ,  B32B27/32 ,  B32B27/36 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  B32B27/08 ,  B32B37/02 ,  B32B37/15 ,  B32B38/00

CPC classification number: H01M2/0287 ,  B32B7/12 ,  B32B15/00 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/16 ,  B32B27/32 ,  B32B27/36 ,  B32B37/02 ,  B32B37/06 ,  B32B37/10 ,  B32B37/1207 ,  B32B37/153 ,  B32B38/0008 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/26 ,  B32B2307/732 ,  B32B2310/14 ,  B32B2311/24 ,  B32B2323/10 ,  B32B2333/00 ,  B32B2367/00 ,  B32B2457/10 ,  B32B2457/16 ,  H01G11/78 ,  H01G11/82 ,  H01G11/84 ,  H01M2/0202 ,  H01M2/026 ,  H01M2/0277 ,  H01M2/028 ,  H01M2/0285 ,  H01M10/0525 ,  H01M2002/0297 ,  H01M2220/30 ,  Y02E60/13

Abstract: A packaging material for a power storage device having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. In the packaging material, the substrate layer is formed of a polyester film having a 50% elongation stress in the range of 100 to 180 MPa and a thermal shrinkage in the range of 1 to 15%, after heat treatment from 160° C. to 200° C., or a polyester film having a difference ΔA in break elongation of 12% or more after heat treatment at 200° C. and 160° C. and having a 50% elongation stress of 75 MPa or more after heat treatment at 200° C.