公开(公告)号：US11406025B2

公开(公告)日：2022-08-02

申请号：US16872811

申请日：2020-05-12

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Takashi Fujita

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/46 ,  H05K1/16

Abstract: A glass wiring board in which a glass substrate with a small thickness is used as a core substrate to prevent glass breakage during manufacture, and an analog splitter composed of a capacitor and an inductor is formed on the glass substrate so as to stabilize the electrical properties of the analog splitter. An inductor is formed using a through electrode which is in contact with an inorganic adhesive layer on a glass substrate on which the inorganic adhesive layer is formed. A capacitor is formed using an insulating resin opening part formed in an insulating resin layer covering the glass substrate having wiring. The inductor and the capacitor are formed on different layers.