Abstract:
A sheet metal member forming method comprises placing a fiber bundle of a predetermined length, via a thermosetting resin, in a predetermined position on a surface of a sheet metal member, forming a coating film on at least a part of the sheet metal member after the placing of the fiber bundle, and while heating and drying the coating film, heat-curing the thermosetting resin to bond the fiber bundle to the sheet metal member.
Abstract:
With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region.
Abstract:
A synthesis device comprises a plurality of pipes, a feeding unit, a reaction vessel, and a measurement mechanism. The pipes extend from a plurality of storage containers, respectively, in which a plurality of types of solutions are stored. The feeding unit is configured to feed the solutions in the storage containers through the pipes. The solutions selectively fed from the storage containers are put in the reaction vessel to generate a synthesized product by chemical synthesis. The measuring mechanism is provided between the storage containers and the reaction vessel in a middle of an overall flow path including the pipes, the measuring mechanism being configured to measure the solutions fed to the reaction vessel.
Abstract:
With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region. This allows for easier formation of the circuit pattern.
Abstract:
A silicon-containing film includes a first chemical vapor deposition layer and a second chemical vapor deposition layer. The first chemical vapor deposition layer includes elemental silicon. The first chemical vapor deposition layer is formed by a plasma CVD method such that oxygen concentration is greater than or equal to 0% by element and less than 10% by element. The second chemical vapor deposition layer includes elemental silicon. The second chemical vapor deposition layer is formed by the plasma CVD method such that oxygen concentration is greater than 35% by element and less than or equal to 70% by element. A ratio of the thickness of the second chemical vapor deposition layer relative to the thickness of the first chemical vapor deposition layer is 1.5-9.