RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

    公开(公告)号:US20190309164A1

    公开(公告)日:2019-10-10

    申请号:US16306684

    申请日:2017-08-03

    Abstract: Disclosed is a resin composition including a thermoplastic resin (A) and a polyrotaxane (B) whose cyclic molecule is modified with a graft chain having a reactive functional group at the end, which are mixed together, the resin composition containing a fibrous filler (C) in the amount of 1 to 200 parts by weight relative to 100 parts by weight of the total amount of the thermoplastic resin (A) and the polyrotaxane (B). To provide a resin composition capable of affording a molded article having excellent balance between rigidity and toughness.

    EPOXY RESIN COMPOSITION, MOLDING MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL

    公开(公告)号:US20240026097A1

    公开(公告)日:2024-01-25

    申请号:US18024579

    申请日:2021-09-06

    CPC classification number: C08J5/042 C08L63/00 C08J2363/00

    Abstract: The present invention aims to provide: an epoxy resin composition in which the effect of adding an additive can be efficiently obtained even at a high temperature; a molding material which achieves a reduced unevenness in physical properties after curing while allowing the additive to exert its effect; and a fiber-reinforced composite material which has excellent mechanical properties while allowing the additive to exert its effect.
    To achieve the above-mentioned object, the epoxy resin composition according to the present invention is an epoxy resin composition including the following components (A) to (E): component (A): an epoxy resin having a viscosity at 25° C. of from 0.1 to 1,000 Pa·s and having two or more epoxy groups within one molecule; component (B): an additive having a viscosity at 25° C. of from 0.01 to 20 Pa·s; component (C): a compound that undergoes a thickening reaction with the epoxy resin at a temperature equal to or lower than a curing temperature; component (D): an epoxy curing agent; and component (E): particles that give thixotropic property. In this epoxy resin composition, the dispersion diameter of the component (B), in a cured product obtained by heat-treating the epoxy resin composition at the curing temperature for 2 hours, is from 0.01 to 5 μm.

    EPOXY RESIN COMPOSITION, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL

    公开(公告)号:US20230030598A1

    公开(公告)日:2023-02-02

    申请号:US17786602

    申请日:2021-01-27

    Abstract: The purpose of the present invention is to provide: an epoxy resin composition having both excellent dispersibility of a solid curing agent and excellent impregnation of reinforcing fibers; a molding material for the fiber-reinforced composite material that has excellent dispersibility of the solid curing agent in the post-thickened resin; and a fiber-reinforced composite material that has excellent appearance quality and mechanical characteristics and little unevenness in physical properties. In order to achieve the aforementioned purpose, this epoxy resin composition has the following configuration. The epoxy resin composition includes all components (A)-(C). The degree of dispersion of component (B) in component (A) is 0.1-0.8, the viscosity at 25° C. is 0.1-100 Pa·s, and the glass transition temperature of an epoxy resin cured product at any hardness between 85%-95% is at least 110° C. Component (A): An epoxy resin having at least two epoxy groups in each molecule Component (B): A solid curing agent Component (C): A dispersant miscible with component (A)

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