公开(公告)号：US20150064378A1

公开(公告)日：2015-03-05

申请号：US14384228

申请日：2013-02-25

Applicant: TOYOBO CO., LTD.

Inventor： Tetsuo Kawakusu

IPC: C09D167/02 ,  B65D25/34 ,  C09D167/00 ,  B65D25/14 ,  C08G63/183 ,  C08G63/00

CPC classification number: C09D167/02 ,  B65D25/14 ,  B65D25/34 ,  C08G18/4227 ,  C08G18/8061 ,  C08G63/00 ,  C08G63/183 ,  C08G63/189 ,  C08G2150/90 ,  C08G2390/40 ,  C09D167/00 ,  C09D175/06 ,  Y10T428/1355 ,  Y10T428/31681

Abstract: This invention provides a polyester resin that is capable of forming a coating film having extremely excellent curability, processability, retort resistance, content resistance, and dent resistance, and also provides a resin composition for a coating composition containing the polyester resin. The polyester resin obtained from a polycarboxylic acid component and a polyol component, wherein the polyester resin meets the conditions (i) to iii) described below: (i) among the polycarboxylic acid components constituting the polyester resin, the total copolymerization ratio of terephthalic acid component and 2,6-naphthalenedicarboxylic acid component is 80 mol % or more; (ii) among the polycarboxylic acid components constituting the polyester resin, the copolymerization ratio of 2,6-naphthalenedicarboxylic acid component is 2 to 80 mol %; and (iii) among the polyol components constituting the polyester resin, the total copolymerization ratio of ethylene glycol component and 1,2-propylene-glycol component is 50 mol % or more, wherein the copolymerization ratio of 1,2-propylene-glycol component is excessive relative to the copolymerization ratio of the ethylene glycol component.

Abstract translation: 本发明提供能够形成具有极好的固化性，加工性，耐蒸煮性，耐含量和耐凹陷性的涂膜的聚酯树脂，并且还提供了含有聚酯树脂的涂料组合物用树脂组合物。 由聚羧酸成分和多元醇成分得到的聚酯树脂，其中聚酯树脂满足下述条件（i）至iii）：（i）在构成聚酯树脂的多元羧酸组分中，对苯二甲酸的总共聚比 成分和2,6-萘二甲酸成分为80摩尔％以上; （ii）构成聚酯树脂的多元羧酸成分中，2,6-萘二羧酸成分的共聚比为2〜80摩尔％。 和（iii）构成聚酯树脂的多元醇成分中，乙二醇成分和1,2-丙二醇成分的总共聚比例为50摩尔％以上，其中1,2-丙二醇成分 相对于乙二醇成分的共聚比过大。

公开(公告)号：US11732164B2

公开(公告)日：2023-08-22

申请号：US16767251

申请日：2019-05-17

Applicant: TOYOBO CO., LTD.

Inventor： Ryo Sonoda ,  Tadahiko Mikami ,  Tetsuo Kawakusu

IPC: C09J11/06 ,  C09J7/30 ,  C09J11/08 ,  C08L63/00 ,  C08L79/08 ,  C08K5/06 ,  H05K1/03 ,  B32B15/09 ,  B32B15/12 ,  B32B15/20 ,  B32B27/10 ,  B32B15/18 ,  C09J123/26 ,  H05K1/02 ,  H05K1/05

CPC classification number: C09J123/26 ,  C09J11/06 ,  H05K1/028 ,  H05K1/056 ,  H05K2201/0154 ,  H05K2201/0355

Abstract: The present invention aims to provide an adhesive composition which exhibits high adhesive property not only to the conventional polyimide and polyester film but also to a metal substrate, can achieve high solder heat resistance and exhibits excellent low-dielectric characteristics. According to the present invention, there is provided an adhesive composition containing an acid-modified polyolefin (a), an oligo-phenylene ether (b) having a number-average molecular weight of 3000 or less, and an epoxy resin (c), wherein the adhesive composition satisfies the following requirement(s) (A) and/or (B):



(A) The adhesive composition contains more than 20 parts by mass and 60 parts by mass or less of the epoxy resin (c) to 100 parts by mass of the acid-modified polyolefin (a);
(B) The adhesive composition further contains a polycarbodiimide (d).