公开(公告)号：US11422463B2

公开(公告)日：2022-08-23

申请号：US17020841

申请日：2020-09-15

Applicant: TPK TOUCH SOLUTIONS INC.

Inventor： Chao-Sung Li ,  Ho-Hsun Chi ,  Fang Fang ,  Zheng-Pang Huang ,  Chien-Hsien Yu ,  Chih-Min Chen ,  Shan-Yu Wu

IPC: G03F7/00 ,  H05K3/02 ,  H05K3/06 ,  G03F7/30 ,  G06F3/041 ,  G06F3/044

Abstract: A touch panel includes a substrate having a display area and a peripheral area. A peripheral circuit is disposed in the peripheral area. The peripheral circuit comprises at least one bonding pad made of a metal layer. A plurality of touch sensing electrodes is disposed in the display area. The plurality of touch sensing electrodes is made of a metal nanowire layer, a film layer disposed on the metal nanowire layer, and a negative-type photosensitive layer disposed on the film layer. The plurality of touch sensing electrodes is electrically connected to the peripheral circuit.

公开(公告)号：US10802398B2

公开(公告)日：2020-10-13

申请号：US16287452

申请日：2019-02-27

Applicant: TPK Touch Solutions Inc.

Inventor： Chao-Sung Li ,  Ho-Hsun Chi ,  Fang Fang ,  Zheng-Pang Huang ,  Chien-Hsien Yu ,  Chih-Min Chen ,  Shan-Yu Wu

IPC: G03F7/00 ,  G03F7/30 ,  G06F3/041 ,  H05K3/02 ,  H05K3/06 ,  G06F3/044

Abstract: The direct patterning method includes: providing a substrate having a display area and a peripheral area, which a peripheral circuit having a bonding pad is disposed on the peripheral area; sequentially disposing a metal nanowire layer, a pre-cured film layer and a negative-type photosensitive layer thereon; performing a photolithography step; and curing the pre-cured film layer. The photolithography step includes exposing the negative-type photosensitive layer to define a removal region and a reserved region; and removing the negative-type photosensitive layer, the pre-cured film layer and the metal nanowire layer in the removal region by using a developer, such that a touch sensing electrode is fabricated in the display area and the bonding pad is exposed.

公开(公告)号：US20190271912A1

公开(公告)日：2019-09-05

申请号：US16287452

申请日：2019-02-27

Applicant: TPK Touch Solutions Inc.

Inventor： Chao-Sung Li ,  Ho-Hsun Chi ,  Fang Fang ,  Zheng-Pang Huang ,  Chien-Hsien Yu ,  Chih-Min Chen ,  Shan-Yu Wu

IPC: G03F7/00 ,  H05K3/02 ,  H05K3/06 ,  G06F3/041 ,  G03F7/30

Abstract: The direct patterning method includes: providing a substrate having a display area and a peripheral area, which a peripheral circuit having a bonding pad is disposed on the peripheral area; sequentially disposing a metal nanowire layer, a pre-cured film layer and a negative-type photosensitive layer thereon; performing a photolithography step; and curing the pre-cured film layer. The photolithography step includes exposing the negative-type photosensitive layer to define a removal region and a reserved region; and removing the negative-type photosensitive layer, the pre-cured film layer and the metal nanowire layer in the removal region by using a developer, such that a touch sensing electrode is fabricated in the display area and the bonding pad is exposed.