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1.发明公开公开(公告)号：US20230288682A1
公开(公告)日：2023-09-14
申请号：US17879032
申请日：2022-08-02
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： SHENG-JIE DING , JIAN-CHAO SONG , JING-WEI LI , DING-NAN HUANG , SHIN-WEN CHEN
CPC classification number: G02B15/143 , G02B7/09 , G03B3/10
Abstract: A simplified zoom lens module includes first to third lens units, first and second driving assemblies, and a housing. The lens units are arranged along an optical axis. The first driving assembly moves the second lens unit back and forth relative to the first lens unit, the second driving assembly moves the third lens unit back and forth relative to the second lens unit. The first driving assembly includes a first magnet which interacts with a second magnet, one being a permanent magnet, the other being an electromagnet. The first magnet is fixed inside the housing, the second magnet is fixed on the second lens unit. The first and second magnets are attracted to or repelled from each other by voltage and current fed to the electromagnet, thereby moving the lens and changing the focus of the lens module. A module and image-capturing device are also disclosed.
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公开(公告)号：US20230171476A1
公开(公告)日：2023-06-01
申请号：US17898940
申请日：2022-08-30
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： JIAN-CHAO SONG , JING-WEI LI , DING-NAN HUANG , SHENG-JIE DING
IPC: H04N5/225
CPC classification number: H04N5/2254 , H04N5/2257
Abstract: A lens module with inbuilt shock-absorbency includes a carrier, a lens barrel arranged on the carrier, a lens assembly accommodated in the lens barrel, and an optical filter arranged on the carrier. The lens assembly includes a buffer member arranged on a bottom of the lens assembly facing the carrier, and a reinforcing member arranged on a side wall of the lens assembly facing the lens barrel. When the lens module is dropped or otherwise impacted, the buffer member reduces the shock of impact applied to the image sensor. The reinforcing member strengths the lens assembly, reducing a risk of loosening of the lens assembly.
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公开(公告)号：US20220060609A1
公开(公告)日：2022-02-24
申请号：US17127428
申请日：2020-12-18
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： SHIN-WEN CHEN , DING-NAN HUANG , KE-HUA FAN , LONG-FEI ZHANG , KUN LI , SHENG-JIE DING
Abstract: A camera module includes a circuit board, a mounting bracket disposed on the circuit board, an image sensor disposed on the circuit board and received in the mounting bracket, a first lens disposed in the mounting bracket, a driving mechanism disposed in the mounting bracket, and a second lens connected to the driving mechanism, and located between the image sensor and the first lens. The driving can drive the second lens to move between the first lens and the image sensor.
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公开(公告)号：US20200076995A1
公开(公告)日：2020-03-05
申请号：US16170535
申请日：2018-10-25
Inventor： DING-NAN HUANG , CHIA-WEI CHEN , SHIN-WEN CHEN
IPC: H04N5/225
Abstract: A camera module with a strong and stable mounting which is geometrically precise includes a printed circuit board, an optical bearing structure, and an image sensor. The printed circuit board includes a mounting surface, the mounting surface defining a conductive circuit area and a surrounding non-conductive peripheral area. The peripheral area comprises a first contact layer, the first contact layer is frame-like and a size of the first contact layer is same as a size of bottom of the optical bearing structure. The optical bearing structure is on the first contact layer and carries a lens module. The image sensor is mounted on the conductive circuit area.
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公开(公告)号：US20220397738A1
公开(公告)日：2022-12-15
申请号：US17830511
申请日：2022-06-02
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： KUN LI , SHIN-WEN CHEN , LONG-FEI ZHANG , XIAO-MEI MA , DING-NAN HUANG
IPC: G02B7/02
Abstract: An impact- and vibration-proof lens module includes a fixing assembly, a circuit board, a lens assembly, and a buffering pad. The fixing assembly defines a chamber, and the circuit board is partially disposed in the chamber. The lens assembly is disposed on the circuit board, and the lens assembly is also partially disposed in the chamber. The buffering pad made of thermally conductive silicon is disposed in the chamber and is disposed between the circuit board and the fixing assembly. In the event of being dropped or suffering vibration, the buffering pad disperses and absorbs stress on the fixing assembly to prevent breakage.
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Patent Agency Ranking
公开(公告)号：US20190393254A1
公开(公告)日：2019-12-26
申请号：US16201916
申请日：2018-11-27
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： CHIA-WEI CHEN , SHIN-WEN CHEN , DING-NAN HUANG
IPC: H01L27/146
Abstract: An encapsulation structure to protect an image sensor chip at all times includes a printed circuit board, an image sensor chip, a protecting structure, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting structure is mounted on the image sensor chip. The protecting structure comprises a filter sheet. The package portion is entirely opaque and is formed on the printed circuit board, wrapping side wall of the printed circuit board, side wall of the protecting structure, and a portion of surface of the filter sheet which is away from the image sensor chip.
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公开(公告)号：US20190182412A1
公开(公告)日：2019-06-13
申请号：US15871119
申请日：2018-01-15
Inventor： DING-NAN HUANG , KUN LI , CHIEN-KUN WU , JING-WEI LI
CPC classification number: H04N5/2257 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H05K1/183 , H05K2201/10151
Abstract: A reduced size of camera module includes a camera lens, an optical filter, a sensor, an optical filter trestle, and a module trestle. The camera lens lies on a light path of the camera module towards the sensor. The camera lens is mounted on the optical filter trestle. The optical filter is received is the optical filter trestle. The optical filter trestle is mounted on the module trestle. The sensor is received in the in the module trestle.
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8.发明公开公开(公告)号：US20240073504A1
公开(公告)日：2024-02-29
申请号：US18070348
申请日：2022-11-28
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： KUN LI , JING GUO , KE-HUA FAN , DING-NAN HUANG
Abstract: A simple and integrated imaging device for housing motor-switchable and laterally-moving filters between a camera-lens holder and an imaging chip comprises the switchable filters in a cavity and a switching mechanism, and a driving mechanism are also in the cavity. The imaging chip is carried by a flexible printed circuit board. The driving mechanism connected to the switching mechanism drives the switching mechanism to slide back and forth underneath the camera-lens holder, so that either the first or the second switchable filter covers a through hole allowing light to fall on the imaging chip. An electronic device including the imaging device is also disclosed.
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9.发明公开公开(公告)号：US20230388634A1
公开(公告)日：2023-11-30
申请号：US17897577
申请日：2022-08-29
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： JIAN-CHAO SONG , DING-NAN HUANG , SHIN-WEN CHEN , KUN LI
CPC classification number: H04N5/23296 , H04N5/2254 , G02B7/09
Abstract: A zoom lens assembly for periscope use which is effectively soundless in operation includes a lens barrel defined with a through hole, a plurality of optical lenses disposed within the through hole, and a focusing member disposed between any two of the plurality of optical lenses. The focusing member in a camera module includes a bottom plate, a cover plate, a piezoelectric element, and a variable transparent body. The variable transparent body is between the bottom plate and the cover plate, the piezoelectric element is disposed on a surface of the cover plate that faces away from the variable transparent body. Electricity fed to the piezoelectric element causes movement of the element which deforms the variable transparent body and changes the focal length of the camera module.
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公开(公告)号：US20210168939A1
公开(公告)日：2021-06-03
申请号：US16860459
申请日：2020-04-28
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： JING-WEI LI , SHIN-WEN CHEN , DING-NAN HUANG , SHENG-JIE DING , JIAN-CHAO SONG
Abstract: A lens module includes a circuit board, a base mounted on the circuit board, and at least one electronic component mounted on the circuit board. The base comprises a first surface and a second surface facing away from the first surface. The second surface is mounted on the circuit board. The base further comprises at least one first hole passing through the first surface and the second surface. The at least one electronic component is received in the at least one first hole. The lens module further comprises a filling layer in each of the at least one first hole and located on a side of the at least one electronic component facing away from the circuit board. The disclosure also provides an electronic device having the lens module.
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