公开(公告)号：US20200285132A1

公开(公告)日：2020-09-10

申请号：US16545242

申请日：2019-08-20

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： SHIN-WEN CHEN ,  JING-WEI LI ,  SHENG-JIE DING ,  MING LI

IPC: G03B13/36 ,  G02B7/09 ,  H02K41/035

Abstract: A lens module with improved structural grounding and adhesion on and to a carrier includes a voice coil motor, a carrier, and a colloid attaching the voice coil motor to the carrier. A wall of the carrier defines at least one hole, and the hole is filled with the colloid to enhance and reinforce a bonding strength between the voice coil motor and the carrier. An electronic device applying such a lens module is also provided.