公开(公告)号：US20220277866A1

公开(公告)日：2022-09-01

申请号：US17747906

申请日：2022-05-18

Applicant: Tsinghua University ,  Tencent Technology (Shenzhen) Company Limited

Inventor： Jianshi TANG ,  Zhenxuan ZHAO ,  Yuan DAI ,  Wangwei LEE ,  Zhengyou ZHANG ,  Jian YUAN ,  Huaqiang WU ,  He QIAN ,  Bin GAO

IPC: H01B1/24 ,  C08K3/04 ,  C09D5/24 ,  C09D7/61 ,  C09D7/40 ,  C09D175/04

Abstract: This application discloses a conductive paste, a preparation method thereof, and a preparation method of a conductive film using the conductive paste. The conductive paste comprises: a thermoplastic polyurethane, conductive particles, and an organic solvent, the thermoplastic polyurethane and the conductive particles being proportionally mixed in the organic solvent, and the thermoplastic polyurethane being dispersed in the form of particles among the conductive particles. A thermoplastic polyurethane elastomer is used as a binder, and the conductive particles are mixed in the organic solvent containing the thermoplastic polyurethane elastomer. The conductive particles ensure the conductivity of the conductive film prepared using the conductive paste. The thermoplastic polyurethane has strong adhesion ability, and is suitable for use on the surface of most substrates, to form a conductive film with good adhesion and no cracking.

公开(公告)号：US20220275220A1

公开(公告)日：2022-09-01

申请号：US17747911

申请日：2022-05-18

Applicant: Tsinghua University ,  Tencent Technology (Shenzhen) Company Limited

Inventor： Jianshi TANG ,  Zhenxuan ZHAO ,  Yuan DAI ,  Zhengyou ZHANG ,  Jian YUAN ,  Huaqiang WU ,  He QIAN ,  Bin GAO

IPC: C09D5/24 ,  C09D7/61 ,  C09D7/20 ,  C09D175/04 ,  C09D163/00 ,  H01C10/10 ,  H01C17/00 ,  B25J9/16

Abstract: Embodiments of this application provide a method for preparing a thin film piezoresistive material, a thin film piezoresistive material, a robot, and a device. The method includes: determining a mass ratio of conductive particles to a cross-linked polymer in preparation of the thin film piezoresistive material, a value range of the mass ratio being 3:97 to 20:80; dispersing the conductive particles and the cross-linked polymer in a solvent according to the mass ratio, to obtain a first dispersion; and curing the first dispersion by using a liquid dropping method within a temperature range of 25° C. to 200° C., to obtain the thin film piezoresistive material. The technical solutions provided by the embodiments of this application provide a method for preparing a thin film piezoresistive material through liquid dropping, thereby effectively controlling the thickness of the piezoresistive material, so that the prepared thin film piezoresistive material has a relatively small thickness.

公开(公告)号：US20220225921A1

公开(公告)日：2022-07-21

申请号：US17605122

申请日：2020-11-19

Applicant: TSINGHUA UNIVERSITY

Inventor： Huaqiang WU ,  Jianshi TANG ,  Jian YUAN

IPC: A61B5/293 ,  A61N1/05 ,  A61N1/36

Abstract: A microelectrode, a method for manufacturing the microelectrode, a method for using the microelectrode, an occluding device, and a microelectrode system are provided. The microelectrode (10) includes a substrate (110) and a conductive layer (120) on the substrate (110), and the conductive layer (120) is configured to conduct an electrical signal. The substrate (110) is a flexible substrate and includes a cavity structure (111), and the cavity structure (111) is configured to contain or release a fluid. The hardness of the substrate (110) in the case where the cavity structure (111) contains the fluid is different from the hardness of the substrate (110) in the case where the cavity structure (111) does not contain the fluid. The microelectrode has good ductility and stable electrical performance, and the microelectrode is easy to be implanted into the biological tissue and not easy to result in the immune reaction of the biological tissue.